Kim, J.; Kang, J.; Yoon, D.; Chung, U.-i.; Ko, D.-H.
Selective Etching of Multi-Stacked Epitaxial Si1-xGex on Si Using CF4/N2 and CF4/O2 Plasma Chemistries for 3D Device Applications. Materials 2025, 18, 4417.
https://doi.org/10.3390/ma18184417
AMA Style
Kim J, Kang J, Yoon D, Chung U-i, Ko D-H.
Selective Etching of Multi-Stacked Epitaxial Si1-xGex on Si Using CF4/N2 and CF4/O2 Plasma Chemistries for 3D Device Applications. Materials. 2025; 18(18):4417.
https://doi.org/10.3390/ma18184417
Chicago/Turabian Style
Kim, Jihye, Joosung Kang, Dongmin Yoon, U-in Chung, and Dae-Hong Ko.
2025. "Selective Etching of Multi-Stacked Epitaxial Si1-xGex on Si Using CF4/N2 and CF4/O2 Plasma Chemistries for 3D Device Applications" Materials 18, no. 18: 4417.
https://doi.org/10.3390/ma18184417
APA Style
Kim, J., Kang, J., Yoon, D., Chung, U.-i., & Ko, D.-H.
(2025). Selective Etching of Multi-Stacked Epitaxial Si1-xGex on Si Using CF4/N2 and CF4/O2 Plasma Chemistries for 3D Device Applications. Materials, 18(18), 4417.
https://doi.org/10.3390/ma18184417