Sloboda, M.; Kolenak, R.; Melus, T.; Gogola, P.; Pasak, M.; Drimal, D.; Drapala, J.
Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials 2025, 18, 3634.
https://doi.org/10.3390/ma18153634
AMA Style
Sloboda M, Kolenak R, Melus T, Gogola P, Pasak M, Drimal D, Drapala J.
Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials. 2025; 18(15):3634.
https://doi.org/10.3390/ma18153634
Chicago/Turabian Style
Sloboda, Mikulas, Roman Kolenak, Tomas Melus, Peter Gogola, Matej Pasak, Daniel Drimal, and Jaromir Drapala.
2025. "Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum" Materials 18, no. 15: 3634.
https://doi.org/10.3390/ma18153634
APA Style
Sloboda, M., Kolenak, R., Melus, T., Gogola, P., Pasak, M., Drimal, D., & Drapala, J.
(2025). Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. Materials, 18(15), 3634.
https://doi.org/10.3390/ma18153634
