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Journal: Materials, 2025
Volume: 18
Number: 3634
3634
Article: Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum
Authors: by Mikulas Sloboda, Roman Kolenak, Tomas Melus, Peter Gogola, Matej Pasak, Daniel Drimal and Jaromir Drapala
Link: https://www.mdpi.com/1996-1944/18/15/3634

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