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Volume 16
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10.3390/ma16062389
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Article

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

by
Siliang He
1,2,
Bifu Xiong
1,
Fangyi Xu
1,
Biyang Chen
1,
Yinhua Cui
2,
Chuan Hu
2,
Gao Yue
1,3,* and
Yu-An Shen
4,*
1
Guangxi Education Department Key Laboratory of Microelectronic Packaging & Assembly Technology, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
2
Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China
3
Guilin Fuda Co., Ltd., Guilin 541199, China
4
Department of Materials Science and Engineering, Feng Chia University, Taichung 407, Taiwan
*
Authors to whom correspondence should be addressed.
Materials 2023, 16(6), 2389; https://doi.org/10.3390/ma16062389
Submission received: 16 February 2023 / Revised: 7 March 2023 / Accepted: 8 March 2023 / Published: 16 March 2023
(This article belongs to the Special Issue Advances in Materials Joining and Additive Manufacturing)
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Abstract

This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu6Sn5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu3Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.
Keywords: TLP bonding; porous Cu; formic acid; soldering; intermetallic compounds TLP bonding; porous Cu; formic acid; soldering; intermetallic compounds

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MDPI and ACS Style

He, S.; Xiong, B.; Xu, F.; Chen, B.; Cui, Y.; Hu, C.; Yue, G.; Shen, Y.-A. Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials 2023, 16, 2389. https://doi.org/10.3390/ma16062389

AMA Style

He S, Xiong B, Xu F, Chen B, Cui Y, Hu C, Yue G, Shen Y-A. Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials. 2023; 16(6):2389. https://doi.org/10.3390/ma16062389

Chicago/Turabian Style

He, Siliang, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue, and Yu-An Shen. 2023. "Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere" Materials 16, no. 6: 2389. https://doi.org/10.3390/ma16062389

APA Style

He, S., Xiong, B., Xu, F., Chen, B., Cui, Y., Hu, C., Yue, G., & Shen, Y.-A. (2023). Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials, 16(6), 2389. https://doi.org/10.3390/ma16062389

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