He, S.; Xiong, B.; Xu, F.; Chen, B.; Cui, Y.; Hu, C.; Yue, G.; Shen, Y.-A.
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials 2023, 16, 2389.
https://doi.org/10.3390/ma16062389
AMA Style
He S, Xiong B, Xu F, Chen B, Cui Y, Hu C, Yue G, Shen Y-A.
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials. 2023; 16(6):2389.
https://doi.org/10.3390/ma16062389
Chicago/Turabian Style
He, Siliang, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue, and Yu-An Shen.
2023. "Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere" Materials 16, no. 6: 2389.
https://doi.org/10.3390/ma16062389
APA Style
He, S., Xiong, B., Xu, F., Chen, B., Cui, Y., Hu, C., Yue, G., & Shen, Y.-A.
(2023). Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere. Materials, 16(6), 2389.
https://doi.org/10.3390/ma16062389