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Journal: Materials, 2023
Volume: 16
Number: 2389
Article:
Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere
Authors:
by
Siliang He, Bifu Xiong, Fangyi Xu, Biyang Chen, Yinhua Cui, Chuan Hu, Gao Yue and Yu-An Shen
Link:
https://www.mdpi.com/1996-1944/16/6/2389
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