Article Versions Notes

Fu Z, Chen J, Zhao P, Guo X, Xiao Q, Fu X, Wang J, Yang C, Xu J, Yang J-Y. Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing. Materials. 2023; 16(3):1134. https://doi.org/10.3390/ma16031134

Fu, Zhiwei, Jian Chen, Pengfei Zhao, Xiaotong Guo, Qingzhong Xiao, Xing Fu, Jian Wang, Chao Yang, Jile Xu, and Jia-Yue Yang. 2023. "Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing" Materials 16, no. 3: 1134. https://doi.org/10.3390/ma16031134

Fu, Z., Chen, J., Zhao, P., Guo, X., Xiao, Q., Fu, X., Wang, J., Yang, C., Xu, J., & Yang, J.-Y. (2023). Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing. Materials, 16(3), 1134. https://doi.org/10.3390/ma16031134