Chen, D.; Qin, J.; Zhang, X.; Liang, D.; Bai, H.; Yi, J.; Yan, J.
Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. Materials 2022, 15, 9004.
https://doi.org/10.3390/ma15249004
AMA Style
Chen D, Qin J, Zhang X, Liang D, Bai H, Yi J, Yan J.
Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. Materials. 2022; 15(24):9004.
https://doi.org/10.3390/ma15249004
Chicago/Turabian Style
Chen, Dongdong, Junhu Qin, Xin Zhang, Dongcheng Liang, Hailong Bai, Jianhong Yi, and Jikang Yan.
2022. "Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints" Materials 15, no. 24: 9004.
https://doi.org/10.3390/ma15249004
APA Style
Chen, D., Qin, J., Zhang, X., Liang, D., Bai, H., Yi, J., & Yan, J.
(2022). Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. Materials, 15(24), 9004.
https://doi.org/10.3390/ma15249004