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Journal: Materials, 2021
Volume: 14
Number: 4619

Article: Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables
Authors: by Yu-Hsiang Yang, Hsiu-Ping Wei, Bongtae Han and Chao Hu
Link: https://www.mdpi.com/1996-1944/14/16/4619

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