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Journal: Materials, 2020
Volume: 13
Number: 831

Article: Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
Authors: by Di Zhao, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin and Fupeng Huo
Link: https://www.mdpi.com/1996-1944/13/4/831

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