Article Versions Notes

Fu X, Liu M, Xu K, Chen S, Shi Y, Fu Z, Huang Y, Chen H, Yao R. The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints. Materials. 2020; 13(23):5497. https://doi.org/10.3390/ma13235497

Fu, Xing, Min Liu, KeXin Xu, Si Chen, YiJun Shi, ZhiWei Fu, Yun Huang, HongTao Chen, and RuoHe Yao. 2020. "The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints" Materials 13, no. 23: 5497. https://doi.org/10.3390/ma13235497

Fu, X., Liu, M., Xu, K., Chen, S., Shi, Y., Fu, Z., Huang, Y., Chen, H., & Yao, R. (2020). The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints. Materials, 13(23), 5497. https://doi.org/10.3390/ma13235497