Next Article in Journal
Reduction and Removal of Chromium VI in Water by Powdered Activated Carbon
Previous Article in Journal
Facile Preparation of Nano-Bi2MoO6/Diatomite Composite for Enhancing Photocatalytic Performance under Visible Light Irradiation
Article Menu
Issue 2 (February) cover image

Export Article

Open AccessArticle
Materials 2018, 11(2), 268; https://doi.org/10.3390/ma11020268

Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

1
Department of Nano Mechanics, Nanomechanical Systems Research Division, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Korea
2
Department of Nano-Mechatronics, Korea University of Science and Technology (UST), 217 Gajeong-Ro, Yuseong-Gu, Daejeon 34113, Korea
3
Department of Laser & Electron Beam Application, Korea Institute of Machinery and Material (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon 34103, Korea
*
Author to whom correspondence should be addressed.
Received: 8 January 2018 / Revised: 2 February 2018 / Accepted: 5 February 2018 / Published: 9 February 2018
(This article belongs to the Section Advanced Nanomaterials)
Full-Text   |   PDF [3010 KB, uploaded 9 February 2018]   |  

Abstract

The development of printing technologies has enabled the realization of electric circuit fabrication on a flexible substrate. However, the current technique remains restricted to single-layer patterning. In this paper, we demonstrate a fully solution-processable patterning approach for multi-layer circuits using a combined method of laser sintering and ablation. Selective laser sintering of silver (Ag) nanoparticle-based ink is applied to make conductive patterns on a heat-sensitive substrate and insulating layer. The laser beam path and irradiation fluence are controlled to create circuit patterns for flexible electronics. Microvia drilling using femtosecond laser through the polyvinylphenol-film insulating layer by laser ablation, as well as sequential coating of Ag ink and laser sintering, achieves an interlayer interconnection between multi-layer circuits. The dimension of microvia is determined by a sophisticated adjustment of the laser focal position and intensity. Based on these methods, a flexible electronic circuit with chip-size-package light-emitting diodes was successfully fabricated and demonstrated to have functional operations. View Full-Text
Keywords: interconnection; multi-layer patterning; laser sintering; femtosecond laser ablation interconnection; multi-layer patterning; laser sintering; femtosecond laser ablation
Figures

Figure 1

This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

Supplementary material

SciFeed

Share & Cite This Article

MDPI and ACS Style

Ji, S.Y.; Choi, W.; Kim, H.-Y.; Jeon, J.-W.; Cho, S.-H.; Chang, W.S. Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials 2018, 11, 268.

Show more citation formats Show less citations formats

Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Related Articles

Article Metrics

Article Access Statistics

1

Comments

[Return to top]
Materials EISSN 1996-1944 Published by MDPI AG, Basel, Switzerland RSS E-Mail Table of Contents Alert
Back to Top