Ji, S.Y.; Choi, W.; Kim, H.-Y.; Jeon, J.-W.; Cho, S.-H.; Chang, W.S.
Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials 2018, 11, 268.
https://doi.org/10.3390/ma11020268
AMA Style
Ji SY, Choi W, Kim H-Y, Jeon J-W, Cho S-H, Chang WS.
Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials. 2018; 11(2):268.
https://doi.org/10.3390/ma11020268
Chicago/Turabian Style
Ji, Seok Young, Wonsuk Choi, Hoon-Young Kim, Jin-Woo Jeon, Sung-Hak Cho, and Won Seok Chang.
2018. "Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing" Materials 11, no. 2: 268.
https://doi.org/10.3390/ma11020268
APA Style
Ji, S. Y., Choi, W., Kim, H.-Y., Jeon, J.-W., Cho, S.-H., & Chang, W. S.
(2018). Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing. Materials, 11(2), 268.
https://doi.org/10.3390/ma11020268