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Journal: Materials, 2018
Volume: 11
Number: 268
Article:
Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing
Authors:
by
Seok Young Ji, Wonsuk Choi, Hoon-Young Kim, Jin-Woo Jeon, Sung-Hak Cho and Won Seok Chang
Link:
https://www.mdpi.com/1996-1944/11/2/268
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