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Journal: Materials, 2018
Volume: 11
Number: 268

Article: Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing
Authors: by Seok Young Ji, Wonsuk Choi, Hoon-Young Kim, Jin-Woo Jeon, Sung-Hak Cho and Won Seok Chang
Link: https://www.mdpi.com/1996-1944/11/2/268

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