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Journal: Sensors, 2022
Volume: 22
Number: 8144
8144
Article: Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
Authors: by Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase and Hideki Takagi
Link: https://www.mdpi.com/1424-8220/22/21/8144

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