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Journal: Sensors, 2020
Volume: 20
Number: 337

Article: A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology
Authors: by Peishuai Song, Chaowei Si, Mingliang Zhang, Yongmei Zhao, Yurong He, Wen Liu and Xiaodong Wang
Link: https://www.mdpi.com/1424-8220/20/2/337

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