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Journal: Sensors, 2020
Volume: 20
Number: 5533
Article:
An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding
Authors:
by
Yunlong Qiu, Wenjie Hu, Changju Wu and Weifang Chen
Link:
https://www.mdpi.com/1424-8220/20/19/5533
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