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        Journal: Sensors, 2020
        Volume: 20 
                	Number: 5533 
                
        
        Article:
        An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding 
        Authors: 
       	by
                    Yunlong Qiu, Wenjie Hu, Changju Wu and Weifang Chen        
        Link:
        https://www.mdpi.com/1424-8220/20/19/5533
        
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