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Sensors 2017, 17(12), 2774;

Laser Scanning Confocal Thermoreflectance Microscope for the Backside Thermal Imaging of Microelectronic Devices

Division of Scientific Instrumentation, Korea Basic Science Institute, 169-148 Gwahak-ro, Yuseong-gu, Daejeon 34133, Korea
Author to whom correspondence should be addressed.
Received: 20 October 2017 / Revised: 24 November 2017 / Accepted: 27 November 2017 / Published: 30 November 2017
(This article belongs to the Section Physical Sensors)
Full-Text   |   PDF [4328 KB, uploaded 30 November 2017]   |  


In this paper, we report on a confocal thermoreflectance imaging system that can examine the thermal characteristics of microelectronic devices by penetrating the backside of a device through the substrate. In this system, the local reflectivity variations due to heat generation in the device are measured point by point by a laser scanning confocal microscope capable of eliminating out-of-focus reflections and the thermoreflectance is extracted via Fourier-domain signal processing. In comparison to the conventional widefield thermoreflectance microscope, the proposed laser scanning confocal thermoreflectance microscope improves the thermoreflectance sensitivity by ~23 times and the spatial resolution by ~25% in backside thermoreflectance measurements. View Full-Text
Keywords: thermal imaging; reflection; confocal microscopy thermal imaging; reflection; confocal microscopy

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Kim, D.U.; Jeong, C.B.; Kim, J.D.; Lee, K.-S.; Hur, H.; Nam, K.-H.; Kim, G.H.; Chang, K.S. Laser Scanning Confocal Thermoreflectance Microscope for the Backside Thermal Imaging of Microelectronic Devices. Sensors 2017, 17, 2774.

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