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Open AccessArticle

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

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Department of Electrical and Electronic Information Engineering, Toyohashi University of Technology, Aichi 441-8580, Japan
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Electronics-Inspired Interdisciplinary Research Institute (EIIRIS), Toyohashi University of Technology, Aichi 441-8580, Japan
*
Author to whom correspondence should be addressed.
Academic Editor: Hung Cao
Sensors 2015, 15(12), 31821-31832; https://doi.org/10.3390/s151229885
Received: 9 October 2015 / Revised: 5 December 2015 / Accepted: 14 December 2015 / Published: 16 December 2015
(This article belongs to the Section Physical Sensors)
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction. View Full-Text
Keywords: wireless power transmission; wafer-level packaging; flip-chip bonding; flexible substrate; rectenna wireless power transmission; wafer-level packaging; flip-chip bonding; flexible substrate; rectenna
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Okabe, K.; Jeewan, H.P.; Yamagiwa, S.; Kawano, T.; Ishida, M.; Akita, I. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems. Sensors 2015, 15, 31821-31832.

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