Search Results (7)

Recent advances in chiplet architectures, heterogeneous integration, 2.5D/3D packaging, high-performance computing, and RF applications have increased the demand for high-density vertical interconnects and low-loss packaging platforms. Glass substrates have attracted considerable attention for next-generation advanced packaging because of their low dielectric loss, high dimensional stability, smooth surface, and compatibility with large-area panel-level processing. Through-glass vias (TGVs) are essential vertical interconnect structures that enable the electrical integration of glass substrates. This focused review summarizes TGV technologies for glass-based advanced packaging from the perspectives of via formation, seed layer deposition, metallization, Cu filling, defect formation, reliability, and plugging-based alternative architectures. Representative TGV formation methods, including laser drilling, selective laser etching, laser-induced deep etching, wet/dry etching, and photosensitive glass processing, are compared. Metallization approaches based on sputtering, electroless plating, ALD/CVD, and hybrid processes are discussed together with Cu electroplating strategies such as conformal plating, bottom-up filling, pulse or pulse-reverse plating, and engineered-geometry filling. Key defects, including voids, seams, pinch-off, seed discontinuity, Cu/glass interfacial delamination, glass cracking, and Cu protrusion, are reviewed in relation to thermomechanical reliability. Finally, polymer/dielectric plugging, plugging/re-drilling, conductive paste plugging, and hybrid Cu/plugging structures are discussed as application-specific alternatives for balancing electrical performance, reliability, manufacturability, yield, and cost. Full article

Based on the widely used wet metal-assisted electroless etching, we develop in this work a novel vapor-phase silver-assisted chemical etching (VP-Ag-ACE) suitable for the elaboration of highly doped p-silicon (Si) nanostructures with strong, visible, and multi-peak photoluminescence (PL) emissions. The lateral and vertical etching rates (LER and VER) were discussed based on the etching mechanism of the VP-Ag-ACE. The antireflective suitability of the vapor-etched layer has been evaluated by a reflectivity measurement and exhibits reflectivity values lower than 3%. The PL emission at both room and low temperatures emissions were deeply discussed and correlated with the structural properties of the Si morphologies and their surface states based on the FTIR results. Full article

The photoluminescence (PL) response of porous Si has potential applications in a number of sensor and bioimaging techniques. However, many questions still remain regarding how to stabilize and enhance the PL signal, as well as how PL responds to environmental factors. Regenerative electroless etching (ReEtching) was used to produce photoluminescent porous Si directly from Si powder. As etched, the material was H-terminated. The intensity and peak wavelength were greatly affected by the rinsing protocol employed. The highest intensity and bluest PL were obtained when dilute HCl(aq) rinsing was followed by pentane wetting and vacuum oven drying. Roughly half of the hydrogen coverage was replaced with –RCOOH groups by thermal hydrosilylation. Hydrosilylated porous Si exhibited greater stability in aqueous solutions than H-terminated porous Si. Pickling of hydrosilylated porous Si in phosphate buffer was used to increase the PL intensity without significantly shifting the PL wavelength. PL intensity, wavelength and peak shape responded linearly with temperature change in a manner that was specific to the surface termination, which could facilitate the use of these parameters in a differential sensor scheme that exploits the inherent inhomogeneities of porous Si PL response. Full article

In this article, we report an electroless method to fabricate porous hexagonal silicon carbide and hexagonal silicon carbide nanoparticles (NPs) as small as 1 nm using wet chemical stain etching. We observe quantum confinement effect for ultrasmall hexagonal SiC NPs in contrast to the cubic SiC NPs. We attribute this difference to the various surface terminations of the two polytypes of SiC NPs. Full article

Zone plates are diffractive optics commonly used in X-ray microscopes. Here, we present a wet-chemical approach for fabricating high aspect ratio Pd/Si zone plate optics aimed at the hard X-ray regime. A Si zone plate mold is fabricated via metal-assisted chemical etching (MACE) and further metalized with Pd via electroless deposition (ELD). MACE results in vertical Si zones with high aspect ratios. The observed MACE rate with our zone plate design is 700 nm/min. The ELD metallization yields a Pd density of 10.7 g/cm ${}^3$ , a value slightly lower than the theoretical density of 12 g/cm ${}^3$ . Fabricated zone plates have a grid design, 1:1 line-to-space-ratio, 30 nm outermost zone width, and an aspect ratio of 30:1. At 9 keV X-ray energy, the zone plate device shows a first order diffraction efficiency of 1.9%, measured at the MAX IV NanoMAX beamline. With this work, the possibility is opened to fabricate X-ray zone plates with low-cost etching and metallization methods. Full article

Hierarchically structured silicon (Si) surfaces with a combination of micro/nano-structures are highly explored for their unique surface and optical properties. In this context, we propose a rapid and facile electroless method to realize hierarchical structures on an entire Si wafer of 3″ diameter. The overall process takes only 65 s to complete, unlike any conventional wet chemical approach that often combines a wet anisotropic etching of (100) Si followed by a metal nanoparticle catalyst etching. Hierarchical surface texturing on Si demonstrates a broadband highly reduced reflectance with average R% ~ 2.7% within 300–1400 nm wavelength. The as-fabricated hierarchical structured Si was also templated on a thin transparent layer of Polydimethylsiloxane (PDMS) that further demonstrated prospects for improved solar encapsulation with high optical clarity and low reflectance (90% and 2.8%). Full article

Due to its high refractive index, reflectance is often a problem when using Germanium for optoelectronic devices integration. In this work, we propose an effective and low-cost nano-texturing method for considerably reducing the reflectance of bulk Germanium. To do so, uniform V-shape pit arrays are produced by wet electroless chemical etching in a 3:1 volume ratio of highly-concentrated hydrochloridric and nitric acids or so-called aqua regia bath using immersion times ranging from 5 to 60 min. The resulting pit morphology, the crystalline structure of the surface and the changes in surface chemistry after nano-patterning are all investigated. Finally, broadband near-infrared reflectance measurements confirm a significant reduction using this simple wet etching protocol, while maintaining a crystalline, dioxide-free, and hydrogen-passivated surface. It is important to mention that reflectance could be further reduced using deeper pits. However, most optoelectronic applications such as photodetectors and solar cells require relatively shallow patterning of the Germanium to allow formation of a pn-junction close to the surface. Full article