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Search Results (4)

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Keywords = thermo plasma nitriding

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17 pages, 5708 KiB  
Article
Microstructure Formation and Mechanical Properties of Multi-Phase Coating by Thermos Plasma Nitriding of Gradient Cu-Ti Films on C61900 Cu Alloy
by Yandan Zhu, Mufu Yan and Quanli Zhang
Appl. Sci. 2021, 11(22), 10843; https://doi.org/10.3390/app112210843 - 17 Nov 2021
Viewed by 1975
Abstract
To improve the processing efficiency and the surface properties of C61900 Cu alloy, a gradient Cu-Ti film with a Ti/Cu atom ratio of 7:1, 7:4, and 1:2 was pre-fabricated by the unbalanced magnetron sputtering process and then nitrided by thermos plasma nitriding. The [...] Read more.
To improve the processing efficiency and the surface properties of C61900 Cu alloy, a gradient Cu-Ti film with a Ti/Cu atom ratio of 7:1, 7:4, and 1:2 was pre-fabricated by the unbalanced magnetron sputtering process and then nitrided by thermos plasma nitriding. The phase structure, elemental composition, and morphology of the modified surface were characterized, and the mechanical properties, including the wear resistance and adhesion properties, were examined. Combining calculation by the first principle method with thermodynamic analysis, the microstructural formation and phase composition of the Cu-Ti-N system were investigated to reveal the mechanism of improved wear resistance, which indicated the possible formation of various Cu-Ti intermetallics and Ti-N compounds. The Al in the C61900 Cu substrate also participated in the generation of the AlCu2Ti compound, which is a ductile phase with good hardness and elastic modulus. Based on the results of a mechanical properties test, it was concluded that an optimized layer structure for the multi-phase coating should include Ti-N compounds as the surface layer and Cu-Ti intermetallics as the intermediate layer. Full article
(This article belongs to the Special Issue Advances in Intelligent Robots and Precision Machining)
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15 pages, 7244 KiB  
Article
Effects of the Prefabricated Cu-Ti Film on the Microstructure and Mechanical Properties of the Multiphase Coating by Thermo Plasma Nitriding on C17200 Cu Alloy
by Yandan Zhu, Mufu Yan, Quanli Zhang, Qiwen Wang and Hangyu Zhuo
Coatings 2019, 9(11), 694; https://doi.org/10.3390/coatings9110694 - 24 Oct 2019
Cited by 6 | Viewed by 2790
Abstract
To improve the surface wear resistance, plasma nitriding of the prefabricated Cu-Ti films on the C17200 Cu alloy is performed to investigate the effects of the composition of the Cu-Ti films on the microstructure and the mechanical properties of the modified surface. The [...] Read more.
To improve the surface wear resistance, plasma nitriding of the prefabricated Cu-Ti films on the C17200 Cu alloy is performed to investigate the effects of the composition of the Cu-Ti films on the microstructure and the mechanical properties of the modified surface. The results firstly showed that obvious microstructure evolution appeared during the thermo-plasma nitriding process, where both the surface morphology of the composed phases and the cross-sectional profiles of the multiphase coatings varied for the three types of films. Small amounts of Ti-N compounds, Be3Ti2Cu, and different types of Cu-Ti intermetallics formed in the multiphase coating after plasma nitriding, which is dependent on the composition of the prefabricated Cu-Ti film. Correspondingly, the surface hardness and the wear resistance of the C17200 Cu substrates were obviously improved, with the obtained adhesive strength of the substrate reaching a satisfactory range. Full article
(This article belongs to the Section Corrosion, Wear and Erosion)
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8 pages, 5367 KiB  
Article
Two-Step Plasma Treatment on Sputtered and Electroplated Cu Surfaces for Cu-To-Cu Bonding Application
by Hankyeol Seo, Hae Sung Park and Sarah Eunkyung Kim
Appl. Sci. 2019, 9(17), 3535; https://doi.org/10.3390/app9173535 - 28 Aug 2019
Cited by 11 | Viewed by 5470
Abstract
The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated, and oxygen-free Cu surface. A two-step plasma treatment [...] Read more.
The technology trends of next generation electronic packaging are moving toward heterogeneous 3D packaging systems. One of the key processes of 3D packaging system is Cu-to-Cu bonding, which is highly dependent on the planarized, activated, and oxygen-free Cu surface. A two-step plasma treatment is studied to form a Cu surface that does not react with oxygen and improves the Cu bonding interface quality at low bonding temperature (300 °C). In this study, the effects of two-step plasma treatment on both sputtered and electroplated Cu surfaces were evaluated through structural, chemical, and electrical analysis. The Cu bonding interface was studied by scanning acoustic tomography analysis after the thermocompression bonding process. Both sputtered and electroplated Cu thin films had the preferred orientation of (111) plane, but sputtered Cu exhibited larger grains than the electroplated Cu. As a result, the roughness of sputtered Cu was lower, and the resistivity was higher than that of electroplated Cu. Based on X-ray photoelectron spectroscopy analysis, the sputtered Cu formed more copper nitrides and fewer copper oxides than the electroplated Cu. A significant improvement in bonding quality at the Cu bonded interface was observed in sputtered Cu. Full article
(This article belongs to the Special Issue Design, Fabrication and Characterization of Novel Graphene/Semiconductor Devices)
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10 pages, 1239 KiB  
Article
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding
by Koki Tanaka, Wei-Shan Wang, Mario Baum, Joerg Froemel, Hideki Hirano, Shuji Tanaka, Maik Wiemer and Thomas Otto
Micromachines 2016, 7(12), 234; https://doi.org/10.3390/mi7120234 - 15 Dec 2016
Cited by 18 | Viewed by 7857
Abstract
To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H [...] Read more.
To increase the yield of the wafer-level Cu-Cu thermo-compression bonding method, certain surface pre-treatment methods for Cu are studied which can be exposed to the atmosphere before bonding. To inhibit re-oxidation under atmospheric conditions, the reduced pure Cu surface is treated by H2/Ar plasma, NH3 plasma and thiol solution, respectively, and is covered by Cu hydride, Cu nitride and a self-assembled monolayer (SAM) accordingly. A pair of the treated wafers is then bonded by the thermo-compression bonding method, and evaluated by the tensile test. Results show that the bond strengths of the wafers treated by NH3 plasma and SAM are not sufficient due to the remaining surface protection layers such as Cu nitride and SAMs resulting from the pre-treatment. In contrast, the H2/Ar plasma–treated wafer showed the same strength as the one with formic acid vapor treatment, even when exposed to the atmosphere for 30 min. In the thermal desorption spectroscopy (TDS) measurement of the H2/Ar plasma–treated Cu sample, the total number of the detected H2 was 3.1 times more than the citric acid–treated one. Results of the TDS measurement indicate that the modified Cu surface is terminated by chemisorbed hydrogen atoms, which leads to high bonding strength. Full article
(This article belongs to the Special Issue 3D Integration Technologies for MEMS)
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