Search Results (9)

We present a hermetically sealed capacitive microelectromechanical system (MEMS) strain sensor designed for arterial pulse waveform extraction using the strain plethysmography (SPG) modality. The MEMS strain sensor features a small form factor of 3.3 mm × 3.3 mm × 1 mm, leverages a nano-gap fabrication process to improve the sensitivity, and uses a differential sensing mechanism to improve the linearity and remove the common mode drift. The MEMS strain sensor is interfaced with an application-specific integrated circuit (ASIC) to form a compact strain sensing system. This system exhibits a high strain sensitivity of 316 aF/µε, a gauge factor (GF) of 35, and a strain sensing resolution of 1.26 µε, while maintaining a linear range exceeding 700 µε. SPG signals have been reliably captured at both the fingertip and wrist using the MEMS strain sensor with high signal quality, preserving various photoplethysmography (PPG) features. Experimental results demonstrate that heart rate (HR) and heart rate variability (HRV) can be estimated from the SPG signal collected at the fingertip and wrist using the sensor with an accuracy of over 99%. Pulse arrival time (PAT) and pulse transit time (PTT) have been successfully extracted using the sensor together with a MEMS seismometer, showcasing its potential for ambulatory BP monitoring (ABPM) application. Full article

Microforce plates are indispensable tools for quantitatively evaluating the behavior of small objects such as tiny insects or microdroplets. The two main measurement principles for microforce plates are: the formation of strain gauges on the beam that supports the plate and the measurement of the deformation of the plate using an external displacement meter. The latter method is characterized by its ease of fabrication and durability as strain concentration is not required. To enhance the sensitivity of the latter type of force plates with a planar structure, thinner plates are generally desired. However, brittle material force plates that are both thin and large and can be fabricated easily have not yet been developed. In this study, a force plate consisting of a thin glass plate with a planar spiral spring structure and a laser displacement meter placed under the plate center is proposed. The plate deforms downward when a force is exerted vertically on its surface, resulting in the determination of the applied force using Hooke’s law. The force plate structure is easily fabricated by laser processing combined with the microelectromechanical system (MEMS) process. The fabricated force plate has a radius and thickness of 10 mm and 25 µm, respectively, with four supporting spiral beams of sub-millimeter width. A fabricated force plate featuring a sub-N/m spring constant achieves a resolution of approximately 0.01 µN. Full article

This paper proposes a novel high-sensitivity micro-electromechanical system (MEMS) piezoresistive pressure sensor that can be used for rock mass stress monitoring. The entire sensor consists of a cross, dual-cavity, and all-silicon bulk-type (CCSB) structure. Firstly, the theoretical analysis is carried out, and the relationship between the structural parameters of the sensor and the stress is analyzed by finite element simulation and curve-fitting prediction, and then the optimal structural parameters are also analyzed. The simulation results indicate that the sensor with the CCSB structure proposed in this article obtained a high sensitivity of 87.74 μV/V/MPA and a low nonlinearity error of 0.28% full-scale span (FSS) within the pressure range of 0–200 MPa. Compared with All-Si Bulk, grooved All-Si Bulk, Si-Glass Bulk, silicon diaphragm, resistance strain gauge, and Fiber Bragg grating structure pressure sensors, the designed sensor has a significant improvement in sensitivity and nonlinearity error. It can be used as a new sensor for rock disaster (such as collapse) monitoring and forecasting. Full article

This paper discussed the application of health monitoring systems to 20th-century historic buildings. Natural disasters are major threats to monuments. They are often seismically vulnerable and require interventions. However, taking into account their historic and cultural values, it is appropriate to observe long-term behaviour before making a decision on intervention schemes. To this aim, health monitoring is considered an effective approach. In recent years, MEMS (micro-electromechanical systems) accelerometers have been attracting attention for their convenience and efficacy. Nonetheless, the reliability of MEMS accelerometers still needs to be examined for the monitoring of monuments as sufficient research contributions have not been made. This paper presented two case studies that were monitored by means of MEMS accelerometers. They were masonry structures positioned in seismic-prone regions in Japan. A number of earthquakes were detected by the accelerometers during one year of monitoring. To examine the accuracy of the adopted MEMS accelerometers, dynamic identification tests were conducted using high-sensitivity strain-gauge accelerometers and servo velocity meters. Based on responses obtained from the tests, numerical simulation was performed. Nonlinear static analysis was performed. The numerical simulation permitted the comparison of reliability among sensors and test types. This paper provided suggestions for the dynamic identification tests of heritage structures. Full article

3C-SiC is an emerging material for MEMS systems thanks to its outstanding mechanical properties (high Young’s modulus and low density) that allow the device to be operated for a given geometry at higher frequency. The mechanical properties of this material depend strongly on the material quality, the defect density, and the stress. For this reason, the use of SiC in Si-based microelectromechanical system (MEMS) fabrication techniques has been very limited. In this work, the complete characterization of Young’s modulus and residual stress of monocrystalline 3C-SiC layers with different doping types grown on <100> and <111> oriented silicon substrates is reported, using a combination of resonance frequency of double clamped beams and strain gauge. In this way, both the residual stress and the residual strain can be measured independently, and Young’s modulus can be obtained by Hooke’s law. From these measurements, it has been observed that Young’s modulus depends on the thickness of the layer, the orientation, the doping, and the stress. Very good values of Young’s modulus were obtained in this work, even for very thin layers (thinner than 1 μm), and this can give the opportunity to realize very sensitive strain sensors. Full article

We present a cost-effective approach to produce silicon strain gauges that can withstand very high voltage without using any complex package design and without sacrificing any sensor performance. This is achieved by a special silicon strain gauge structure created on an alkali-free glass substrate that has a high breakdown voltage. A half-bridge silicon strain gauge is designed, fabricated, and then tested to measure its output characteristics. The device has a glass layer that is only 25–55 µm thick; it shows it is able to withstand a voltage of over 2000 V while maintaining a high degree of linearity with correlation coefficients higher than 0.9990 and an average sensitivity of 104.13. Due to their unique electrical properties, silicon strain gauges-on-glass chips hold much promise for use in advanced force and pressure sensors. Full article

With the advancement trend of lower limb prosthetics headed towards bionics (active ankle and knee) and smart prosthetics (gait and condition monitoring), there is an increasing integration of various sensors (micro-electromechanical system (MEMS) accelerometers, gyroscopes, magnetometers, strain gauges, pressure sensors, etc.), microcontrollers and wireless systems, and power drives including motors and actuators. All of these active elements require electrical power. However, inclusion of a heavy and bulky battery risks to undo the lightweight advancements achieved by the strong and flexible composite materials in the past decades. Kinetic energy harvesting holds the promise to recharge a small on-board battery in order to sustain the active systems without sacrificing weight and size. However, careful design is required in order not to over-burden the user from parasitic effects. This paper presents a feasibility study using measured gait data and numerical simulation in order to predict the available recoverable power. The numerical simulations suggest that, depending on the axis, up to 10s mW average electrical power is recoverable for a walking gait and up to 100s mW average electrical power is achievable during a running gait. This takes into account parasitic losses and only capturing a fraction of the gait cycle to not adversely burden the user. The predicted recoverable power levels are ample to self-sustain wireless communication and smart sensing functionalities to support smart prosthetics, as well as extend the battery life for active actuators in bionic systems. The results here serve as a theoretical foundation to design and develop towards regenerative smart bionic prosthetics. Full article

Polymer Micro ElectroMechanical Systems (MEMS) have the potential to constitute a powerful alternative to silicon-based MEMS devices for sensing applications. Although the use of commercial photoresists as structural material in polymer MEMS has been widely reported, the integration of functional polymer materials as electromechanical transducers has not yet received the same amount of interest. In this context, we report on the design and fabrication of different electromechanical schemes based on polymeric materials ensuring different transduction functions. Piezoresistive transduction made of carbon nanotube-based nanocomposites with a gauge factor of 200 was embedded within U-shaped polymeric cantilevers operating either in static or dynamic modes. Flexible resonators with integrated piezoelectric transduction were also realized and used as efficient viscosity sensors. Finally, piezoelectric-based organic field effect transistor (OFET) electromechanical transduction exhibiting a record sensitivity of over 600 was integrated into polymer cantilevers and used as highly sensitive strain and humidity sensors. Such advances in integrated electromechanical transduction schemes should favor the development of novel all-polymer MEMS devices for flexible and wearable applications in the future. Full article

Cutting force measurement is a quintessential task for status monitoring during machining. In the past, a number of cutting force sensors have been developed, each featuring a different set of performance advantages. In a pursuit to improve the measuring sensitivity and reduce the cross-interference error, in this paper we propose a triaxial cutting force sensor based on a commercial micro-electro-mechanical system (MEMS) strain gauge. An elastic-sensitive element comprised of two mutual-perpendicular octagonal rings is designed for triaxial cutting force measurement, and a decoupling matrix is derived from static calibration to reduce cross-interference. It can be concluded from static calibration that the sensor’s sensitivity is 0.32 mV/N, 0.32 mV/N, and 0.05 mV/N in triaxial directions, and the proposed decoupling matrix is able to reduce cross-interference error to 0.14%, 0.25%, and 4.42%. Dynamic cutting force measurement shows that the cutting force sensor can reflect the variation of cutting status very well, it is qualified to measure triaxial cutting forces in practical applications. Full article