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Keywords = chip-on-foil

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15 pages, 2341 KiB  
Article
Roll-to-Roll (R2R) High-Throughput Manufacturing of Foil-Based Microfluidic Chips for Neurite Outgrowth Studies
by Nihan Atak, Martin Smolka, Anja Haase, Alexandra Lorenz, Silvia Schobesberger, Stephan Ruttloff, Christian Wolf, Ana Ayerdi-Izquierdo, Peter Ertl, Nerea Briz Iceta, Jan Hesse and Martin Frauenlob
Micromachines 2025, 16(6), 713; https://doi.org/10.3390/mi16060713 - 16 Jun 2025
Viewed by 1755
Abstract
Microfluidic devices have emerged as a pivotal in vitro technology for axon outgrowth studies, facilitating the separation of the cell body from the neurites by geometric constraints. However, traditional microfabrication techniques fall short in terms of scalability for large-scale production, hindering widespread application. [...] Read more.
Microfluidic devices have emerged as a pivotal in vitro technology for axon outgrowth studies, facilitating the separation of the cell body from the neurites by geometric constraints. However, traditional microfabrication techniques fall short in terms of scalability for large-scale production, hindering widespread application. This study presents the development of foil-based cell culture chips, made of polyethylene terephthalate and in-house formulated ultraviolet curable liquid resin by high-throughput roll-to-roll (R2R) manufacturing. Here, two microchannel designs were tested to optimize manufacturing quality and assess the neurite outgrowth behavior. The fabricated neuron-foil chips demonstrated biocompatibility and supported neurite outgrowth within microchannels under static cell culture conditions. Furthermore, fluidic flow, oriented either perpendicular or parallel to the microchannel direction, was applied to enhance the biological reproducibility within the neuron-foil chips. These findings suggest that R2R manufacturing offers a promising approach for the high-throughput production of biocompatible microfluidic devices, advancing their potential application in modeling neurological diseases within the biomedical industry. Full article
(This article belongs to the Section B2: Biofabrication and Tissue Engineering)
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21 pages, 2081 KiB  
Article
Translation of COVID-19 Serology Test on Foil-Based Lateral Flow Chips: A Journey from Injection Molding to Scalable Roll-to-Roll Nanoimprint Lithography
by Pakapreud Khumwan, Stephan Ruttloff, Johannes Götz, Dieter Nees, Conor O’Sullivan, Alvaro Conde, Mirko Lohse, Christian Wolf, Nastasia Okulova, Janine Brommert, Richard Benauer, Ingo Katzmayr, Nikolaus Ladenhauf, Wilfried Weigel, Maciej Skolimowski, Max Sonnleitner, Martin Smolka, Anja Haase, Barbara Stadlober and Jan Hesse
Biosensors 2025, 15(4), 229; https://doi.org/10.3390/bios15040229 - 4 Apr 2025
Viewed by 788
Abstract
Lateral flow tests (LFTs) had a pivotal role in combating the spread of the SARS-CoV-2 virus throughout the COVID-19 pandemic thanks to their affordability and ease of use. Most of LFT devices were based on nitrocellulose membrane strips whose industrial upscaling to billions [...] Read more.
Lateral flow tests (LFTs) had a pivotal role in combating the spread of the SARS-CoV-2 virus throughout the COVID-19 pandemic thanks to their affordability and ease of use. Most of LFT devices were based on nitrocellulose membrane strips whose industrial upscaling to billions of devices has already been extensively demonstrated. Nevertheless, the assay option in an LFT format is largely restricted to qualitative detection of the target antigens. In this research, we surveyed the potential of UV nanoimprint lithography (UV-NIL) and extrusion coating (EC) for the high-throughput production of disposable capillary-driven, foil-based tests that allow multistep assays to be implemented for quantitative readout to address the inherent lack of on-demand fluid control and sensitivity of paper-based devices. Both manufacturing technologies operate on the principle of imprinting that enables high-volume, continuous structuring of microfluidic patterns in a roll-to-roll (R2R) production scheme. To demonstrate the feasibility of R2R-fabricated foil chips in a point-of-care biosensing application, we adapted a commercial chemiluminescence multiplex test for COVID-19 antibody detection originally developed for a capillary-driven microfluidic chip manufactured with injection molding (IM). In an effort to build a complete ecosystem for the R2R manufacturing of foil chips, we also recruited additional processes to streamline chip production: R2R biofunctionalization and R2R lamination. Compared to conventional fabrication techniques for microfluidic devices, the R2R techniques highlighted in this work offer unparalleled advantages concerning improved scalability, dexterity of seamless handling, and significant cost reduction. Our preliminary evaluation indicated that the foil chips exhibited comparable performance characteristics to the original IM-fabricated devices. This early success in assay translation highlights the promise of implementing biochemical assays on R2R-manufactured foil chips. Most importantly, it underscores the potential utilization of UV-NIL and EC as an alternative to conventional technologies for the future development in vitro diagnostics (IVD) in response to emerging point-of-care testing demands. Full article
(This article belongs to the Special Issue Biosensing Technologies in Medical Diagnosis)
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12 pages, 6450 KiB  
Article
An Electrochemical Nickel–Cobalt (Ni–Co)/Graphene Oxide-Polyvinyl Alcohol (GO-PVA) Sensor for Glucose Detection
by Shu-Hui Yeh, Yaw-Jen Chang and Chun-Yi Hsieh
Sensors 2025, 25(7), 2050; https://doi.org/10.3390/s25072050 - 25 Mar 2025
Viewed by 660
Abstract
This paper presents a non-enzymatic sensor for glucose detection in an environment where glucose and insulin coexist. The sensor is based on a three-electrode chip fabricated by etching the copper foil of a printed circuit board. The working electrode is coated with a [...] Read more.
This paper presents a non-enzymatic sensor for glucose detection in an environment where glucose and insulin coexist. The sensor is based on a three-electrode chip fabricated by etching the copper foil of a printed circuit board. The working electrode is coated with a graphene oxide-polyvinyl alcohol composite film, followed by the electroplating of a nickel–cobalt layer and an additional surface treatment using O2 plasma. The experimental results indicate that within a glucose concentration of 2 mM to 10 mM and an insulin concentration of 0.1 mM to 1 mM, the measured current exhibits a linear relationship with the concentration of glucose or insulin, regardless of whether cyclic voltammetry or linear sweep voltammetry is used. However, the detection limit for insulin is 0.01 mM, ensuring that glucose detection remains unaffected by insulin interference. In this sensor, nickel–cobalt serves as a catalyst for glucose and insulin detection, while the graphene oxide-polyvinyl alcohol composite enhances sensing performance. Full article
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18 pages, 14690 KiB  
Article
Influence of the Oscillation Parameters Amplitude and Frequency on the Microstructure of Laser-Welded Thin Nitinol Foils
by Danka Katrakova-Krüger, Sabine Weichert and Christoph Hartl
J. Manuf. Mater. Process. 2025, 9(2), 32; https://doi.org/10.3390/jmmp9020032 - 23 Jan 2025
Viewed by 978
Abstract
Laser welding has become well established for joining Ni-Ti-based shape memory alloys and extends the manufacturability of highly functional components with complex geometries. Published studies on the effect of laser welding on alterations to microstructure and properties of these alloys, however, mainly deal [...] Read more.
Laser welding has become well established for joining Ni-Ti-based shape memory alloys and extends the manufacturability of highly functional components with complex geometries. Published studies on the effect of laser welding on alterations to microstructure and properties of these alloys, however, mainly deal with conventional component dimensions and linear laser beam movement. In view of the increasing importance of microtechnology, research into joining of thin-walled Ni-Ti components is therefore of interest. At the same time, studies comparing oscillating and linear beam movement on other materials and the authors’ own work on Ni-Ti materials suggest that oscillating beam movement has a more favorable effect on alterations in material properties and microstructure. Therefore, laser welding of foils made of Ni55/Ti45 with 125 µm thickness was systematically analyzed using a fiber laser and circular oscillation. Amplitude A and frequency f were varied from 0 to 200 µm and 0 to 2000 Hz, respectively. Microstructural analysis showed that by increasing the frequency, grain refinement could be achieved up to a certain value of f. An increasing amplitude led to decreasing hardness values of the weld seam, while the influence of f was less pronounced. The analysis of the weld material using chip calorimetry (Flash DSC) revealed that the beam oscillation had fewer effects on the change in transformation points compared to a linear beam movement. Full article
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13 pages, 3619 KiB  
Article
Flexible Artificial Ag NPs:a–SiC0.11:H Synapse on Al Foil with High Uniformity and On/Off Ratio for Neuromorphic Computing
by Zongyan Zuo, Chengfeng Zhou, Zhongyuan Ma, Yufeng Huang, Liangliang Chen, Wei Li, Jun Xu and Kunji Chen
Nanomaterials 2024, 14(18), 1474; https://doi.org/10.3390/nano14181474 - 10 Sep 2024
Cited by 1 | Viewed by 1329
Abstract
A neuromorphic computing network based on SiCx memristor paves the way for a next-generation brain-like chip in the AI era. Up to date, the SiCx–based memristor devices are faced with the challenge of obtaining flexibility and uniformity, which can push [...] Read more.
A neuromorphic computing network based on SiCx memristor paves the way for a next-generation brain-like chip in the AI era. Up to date, the SiCx–based memristor devices are faced with the challenge of obtaining flexibility and uniformity, which can push forward the application of memristors in flexible electronics. For the first time, we report that a flexible artificial synaptic device based on a Ag NPs:a–SiC0.11:H memristor can be constructed by utilizing aluminum foil as the substrate. The device exhibits stable bipolar resistive switching characteristic even after bending 1000 times, displaying excellent flexibility and uniformity. Furthermore, an on/off ratio of approximately 107 can be obtained. It is found that the incorporation of silver nanoparticles significantly enhances the device’s set and reset voltage uniformity by 76.2% and 69.7%, respectively, which is attributed to the contribution of the Ag nanoparticles. The local electric field of Ag nanoparticles can direct the formation and rupture of conductive filaments. The fitting results of I–V curves show that the carrier transport mechanism agrees with Poole–Frenkel (P–F) model in the high-resistance state, while the carrier transport follows Ohm’s law in the low-resistance state. Based on the multilevel storage characteristics of the Al/Ag NPs:a–SiC0.11:H/Al foil resistive switching device, we successfully observed the biological synaptic characteristics, including the long–term potentiation (LTP), long–term depression (LTD), and spike–timing–dependent plasticity (STDP). The flexible artificial Ag NPs:a–SiC0.11:H/Al foil synapse possesses excellent conductance modulation capabilities and visual learning function, demonstrating the promise of application in flexible electronics technology for high-efficiency neuromorphic computing in the AI period. Full article
(This article belongs to the Special Issue Controlled Growth and Properties of Semiconductor Nanomaterials)
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14 pages, 5029 KiB  
Article
Characterization of Micro-Holes Drilled Using a UV Femtosecond Laser in Modified Polyimide Flexible Circuit Boards
by Lijuan Zheng, Shuzhan Lin, Huijuan Lu, Bing Huang, Yu Liu, Jun Wang, Xin Wei, Jun Wang and Chengyong Wang
Micromachines 2024, 15(9), 1078; https://doi.org/10.3390/mi15091078 - 26 Aug 2024
Cited by 1 | Viewed by 1713
Abstract
Modified polyimide (MPI) flexible printed circuits (FPCs) are used as chip carrier boards. The quality of the FPC directly affects the reliability of the integrated circuit. Furthermore, micro-holes are critical components of FPCs. In this study, an ultraviolet (UV) femtosecond laser is used [...] Read more.
Modified polyimide (MPI) flexible printed circuits (FPCs) are used as chip carrier boards. The quality of the FPC directly affects the reliability of the integrated circuit. Furthermore, micro-holes are critical components of FPCs. In this study, an ultraviolet (UV) femtosecond laser is used to drill micro-holes in double-layer flexible circuit boards with MPI as the substrate. The morphology of the micro-hole wall in the copper foil and MPI layer is observed, and the effects of the laser processing parameters on the diameter and depth of the micro-holes are analyzed. The drilling process and mechanism of micro-holes obtained using a UV femtosecond laser in MPI FPCs are discussed. The results show that the morphology of femtosecond laser-machined copper is closely related to the laser energy, and a periodic structure is observed during the machining process. Copper, MPI, and copper oxides are the most common molten deposits in micro-holes during drilling. The depth of the micro-holes increases with an increase in the energy of a single pulse, scanning time, and scanning overlap rate of the laser beam. However, the diameter exhibits no discernible alteration. The material removal rate increased significantly when laser processing was applied to the MPI resin layer. Full article
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18 pages, 9007 KiB  
Article
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration
by Tzu-Jung Huang, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon and Ivan Puchades
Electronics 2024, 13(10), 1818; https://doi.org/10.3390/electronics13101818 - 8 May 2024
Viewed by 2576
Abstract
Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates [...] Read more.
Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates are a new alternative with similar properties to those of semiconductor-based substrates but with the added benefits of higher flexibility and metal ductility. This work comprehensively compares the thermal properties of a novel metal-based substrate, molybdenum, and silicon and fused silica glass substrates in the context of system-on-foil (SoF) integration. A simple electronic technique is used to simulate the heat generated by a typical CPU and to measure the heat dissipation properties of the substrates. The results indicate that molybdenum and silicon are able to effectively dissipate a continuous power density of 2.3 W/mm2 as the surface temperature only increases by ~15 °C. In contrast, the surface temperature of fused silica glass substrates increases by >140 °C for the same applied power. These simple techniques and measurements were validated with infrared camera measurements as well as through finite element analysis via COMSOL simulation. The results validate the use of molybdenum as an advanced packaging substrate and can be used to characterize new substrates and approaches for advanced packaging. Full article
(This article belongs to the Special Issue Advances in Optical Communication and Optical Computing)
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13 pages, 4676 KiB  
Article
A Micro Bridge-Wing-Thickened Low-Energy Exploding Foil Initiator Chip
by Pengfei Xue, Heng Hu, Tao Wang, Peng Xiong, Mingyu Li and Qingxuan Zeng
Micromachines 2024, 15(5), 589; https://doi.org/10.3390/mi15050589 - 28 Apr 2024
Cited by 3 | Viewed by 3396
Abstract
To enhance the energy efficiency of exploding foil initiator systems (EFIs) and mitigate energy loss due to ablation in the bridge-wing regions, a low-energy bridge-wing-thickened EFI chip was designed and fabricated. Computational analysis revealed that increasing the thickness of the bridge flanks significantly [...] Read more.
To enhance the energy efficiency of exploding foil initiator systems (EFIs) and mitigate energy loss due to ablation in the bridge-wing regions, a low-energy bridge-wing-thickened EFI chip was designed and fabricated. Computational analysis revealed that increasing the thickness of the bridge flanks significantly reduces ablation within the bridge region during the electrical explosion. The refinement of the design led to the adoption of a bridge flank thickness of 19 μm, with the bridge area dimensions specified as 0.25 mm × 0.25 mm × 4 μm. This bridge-wing-thickened EFI chip was produced by employing micro-electro-mechanical systems (MEMS) technology and underwent rigorous performance evaluations. The empirical results closely matched the computational predictions, thereby corroborating the precision of the proposed model in simulating the temperature distribution seen during the explosion process. Notably, this enhanced EFI design achieves a flyer velocity of 3800 m/s at a condition of 900 V/0.22 μF, signifying a significant advancement in EFI system efficiency and performance. Full article
(This article belongs to the Section E:Engineering and Technology)
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13 pages, 5267 KiB  
Article
Design, Fabrication, and Characterization of a Planar Three-Electrode Trigger Switch Based on Flexible Printed Circuit Process
by Pengfei Xue, Peng Xiong, Heng Hu, Tao Wang, Mingyu Li and Qingxuan Zeng
Micromachines 2024, 15(5), 586; https://doi.org/10.3390/mi15050586 - 28 Apr 2024
Cited by 1 | Viewed by 2856
Abstract
An exploding foil initiator system (EFIs) is essential in modern weaponry for its safety and reliability. As the main component of EFIs, the performance of the switch is critical to EFIs. In this study, a planar three-electrode trigger switch was designed and fabricated [...] Read more.
An exploding foil initiator system (EFIs) is essential in modern weaponry for its safety and reliability. As the main component of EFIs, the performance of the switch is critical to EFIs. In this study, a planar three-electrode trigger switch was designed and fabricated using the Flexible Printed Circuits (FPC) process. Subsequently, the performance of the FPC switch was tested. The results show that the self-breakdown voltage of the FPC switch is stable. In addition, an FPF switch with a 0.6 mm main electrode gap demonstrated consistency, with delay times below 31.75 ns, and a jitter ranging from 1.7 ns to 10.94 ns at 900 V to 1200 V, evidencing the FPC switches’ reliability and uniform performance across various voltages. Compared to the Micro-Electro-Mechanical Systems (MEMS) switches of similar dimensions, the FPC switches achieved a faster high-current attainment with less inductance, showing a 5% reduction in loop inductance. The repetitive testing results demonstrate that the FPC switch maintains consistent output performance, with stable peak currents, peak current time, and delay time over 50 action cycles, highlighting its repeatability. The FPC switch was assembled with an EFI chip and capacitor into an integrated system, which was subsequently able to successfully detonate HNS-IV at 1000 V/0.22 μF, proving the FPC switch’s potential in low inductance applications. Full article
(This article belongs to the Section E:Engineering and Technology)
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3 pages, 416 KiB  
Abstract
Fabrication of an Ultrathin PMMA Foil for Sensing Applications in Microfluidic Systems
by Rafael Ecker, Tina Mitteramskogler, Andreas Fuchsluger and Bernhard Jakoby
Proceedings 2024, 97(1), 48; https://doi.org/10.3390/proceedings2024097048 - 19 Mar 2024
Viewed by 902
Abstract
This research work focuses on the fabrication of ultrathin polymethylmethacrylate (PMMA) foils using a spin coating process of in anisole dissolved PMMA on a water-soluble polyvinyl alcohol (PVA) foil. Currently, layer thicknesses as low as 1 µm can be achieved and even thinner [...] Read more.
This research work focuses on the fabrication of ultrathin polymethylmethacrylate (PMMA) foils using a spin coating process of in anisole dissolved PMMA on a water-soluble polyvinyl alcohol (PVA) foil. Currently, layer thicknesses as low as 1 µm can be achieved and even thinner layers appear to be possible. Sensors and actuators can be applied to the foils and directly integrated into the center of the channel of a polymer-based microfluidic chip. Specifically, the foil acts as a supporting structure that helps to position the sensor in the center of the channel. Thermal sensors, in particular, benefit from the low heat capacity of the foil. This will improve the performance and the accuracy of these sensors of which the impact on the fluidic flow is minimized. Full article
(This article belongs to the Proceedings of XXXV EUROSENSORS Conference)
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14 pages, 3711 KiB  
Article
Flow-Based CL-SMIA for the Quantification of Protein Biomarkers from Nasal Secretions in Comparison with Sandwich ELISA
by Julia Neumair, Marie Kröger, Evamaria Stütz, Claudia Jerin, Adam M. Chaker, Carsten B. Schmidt-Weber and Michael Seidel
Biosensors 2023, 13(7), 670; https://doi.org/10.3390/bios13070670 - 22 Jun 2023
Cited by 3 | Viewed by 2261
Abstract
Protein biomarkers in nasal secretions can be used as a measure to differentiate between allergies, airway diseases and infections for non-invasive diagnostics. The point-of-care quantification of biomarker levels using flow-based microarray facilitates precise and rapid diagnosis and displays the potential for targeted and [...] Read more.
Protein biomarkers in nasal secretions can be used as a measure to differentiate between allergies, airway diseases and infections for non-invasive diagnostics. The point-of-care quantification of biomarker levels using flow-based microarray facilitates precise and rapid diagnosis and displays the potential for targeted and effective treatment. For the first time, we developed a flow-based chemiluminescence sandwich microarray immunoassay (CL-SMIA) for the quantification of nasal interferon-beta (IFN-β) on the Microarray Chip Reader-Research (MCR-R). Polycarbonate foils are used as a cost-effective surface for immobilizing capture antibodies. By using a commercially available set of anti-human IFN-β antibodies, the CL-SMIA can be compared directly to an enzyme-linked immunosorbent assay (ELISA) performed in microtiter plates concerning the bioanalytical performance and economic issues. Pre-incubation of the sample with detection antibodies facilitates the lower consumption of detection antibodies, as this allows for a longer interaction time between the antibody and the biomarker. The direct injection of pre-incubated samples into the microarray chips eliminates the adsorption of proteins in the tubing as well as the contamination of the tubing and valves of the MCR-R with clinical samples. The small flow cell allows for a low sample volume of 50 μL. The limit of detection of 4.53 pg mL−1 was slightly increased compared to a sandwich ELISA performed on microtiter plates which were 1.60 pg mL−1. The possibility to perform the CL-SMIA in a multiplexed mode makes it a promising assay for the rapid and cost-effective non-invasive detection of biomarkers in nasal secretions. Full article
(This article belongs to the Special Issue Feature Issue of Biosensors and Healthcare Section)
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18 pages, 4726 KiB  
Review
A Comprehensive Review of Large-Strain-Extrusion Machining Process for Production of Fine-Grained Materials
by Muralimohan Gurusamy and Balkrishna C. Rao
Crystals 2023, 13(1), 131; https://doi.org/10.3390/cryst13010131 - 11 Jan 2023
Cited by 2 | Viewed by 2708
Abstract
Bulk nanostructured metals and alloys are finding increasing structural applications due to their superior mechanical properties. The methods that rely on the severe plastic deformation technique for effecting microstructural refinement through imposing large strains are utilized mostly to produce nanostructured materials. The machining [...] Read more.
Bulk nanostructured metals and alloys are finding increasing structural applications due to their superior mechanical properties. The methods that rely on the severe plastic deformation technique for effecting microstructural refinement through imposing large strains are utilized mostly to produce nanostructured materials. The machining process has been demonstrated as a simple process for severe plastic deformation by imposing large strains through a single pass of the cutting tool where strains in a range of 1–15 can be imposed for a variety of materials by varying the cutting conditions and tool geometry. However, the geometry of the resulting chip subjected to severe plastic deformation during the machining process is not under control and, hence, a variant of the machining process, called the large-strain-extrusion machining process, has been proposed and utilized extensively for producing bulk nanostructured materials. Large-strain-extrusion machining possesses simultaneous control over microstructure refinement, through managing the strain during large-strain machining, and the shape and dimension of the resulting chip by the extrusion process. This study provides a comprehensive review of the large-strain-extrusion machining process by presenting the findings related to the utilization of this process for the production of fine-grained foils for various metals and alloys. Further research efforts related to finite-element modelling of large-strain-extrusion machining and their usefulness in designing the experimental setup and process conditions are also discussed. Full article
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15 pages, 3685 KiB  
Article
Ion Lithography of Single Ions Irradiation for Spatially Regular Arrays of Pores in Membranes of Polyethylene Terephthalate
by Mariapompea Cutroneo, Vladimir Hnatowicz, Anna Mackova, Petr Malinsky, Romana Miksova, Giovanni Ceccio, Jan Maly, Jiří Smejkal, Marcel Štofik and Vladimir Havranek
Nanomaterials 2022, 12(22), 3927; https://doi.org/10.3390/nano12223927 - 8 Nov 2022
Cited by 7 | Viewed by 1741
Abstract
Routinely, in membrane technology, the decay from radioactive particles or the bombardment of ions with MeV energy per nucleon have been employed for the production of narrow and long pores in membranes. Presently, the ion lithography is proposed to make the fabrication cost [...] Read more.
Routinely, in membrane technology, the decay from radioactive particles or the bombardment of ions with MeV energy per nucleon have been employed for the production of narrow and long pores in membranes. Presently, the ion lithography is proposed to make the fabrication cost more affordable. It is prospective for the use of medium capacity accelerators making more feasible the fabrication of customized membranes. Thin polyethylene terephthalate foils have been patterned using 12 MeV O5+ ions and then processed to obtain good aspect ratio ion track pores in membranes. Pores of micrometric diameter with the following profiles were fabricated in the membranes: truncated cone, double conical, ideal cone, and cylindrical. Monitoring of the shape and size of pores has been attempted with a combination of Scanning Transmission Ion Microscope and a newly designed simulation program. This study is focused on the use of low-energy ions, accomplished in all laboratories, for the fabrication of membranes where the pores are not randomly traced and exhibit higher surface density and negligible overlapping than in membranes commonly manufactured. The good reproducibility and the ordered pore locations can be potentially utilized in applications such as microfluidics and organ-on-chip microsystems, where cells growing over porous substrates are used in simulation of biological barriers and transport processes. Full article
(This article belongs to the Special Issue Advances in Nanoscale Materials in Biomedicine)
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9 pages, 6910 KiB  
Communication
Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays
by Maolei Zhou, Chresten von der Heide and Andreas Dietzel
Sensors 2022, 22(13), 4723; https://doi.org/10.3390/s22134723 - 22 Jun 2022
Cited by 3 | Viewed by 1818
Abstract
Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, [...] Read more.
Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors. Full article
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14 pages, 3586 KiB  
Article
Compact Microfluidic Platform with LED Light-Actuated Valves for Enzyme-Linked Immunosorbent Assay Automation
by Mireia Burdó-Masferrer, María Díaz-González, Ana Sanchis, Álvaro Calleja, María-Pilar Marco, César Fernández-Sánchez and Antonio Baldi
Biosensors 2022, 12(5), 280; https://doi.org/10.3390/bios12050280 - 27 Apr 2022
Cited by 3 | Viewed by 4255
Abstract
Lab-on-a-chip devices incorporating valves and pumps can perform complex assays involving multiple reagents. However, the instruments used to drive these chips are complex and bulky. In this article, a new wax valve design that uses light from a light emitting diode (LED) for [...] Read more.
Lab-on-a-chip devices incorporating valves and pumps can perform complex assays involving multiple reagents. However, the instruments used to drive these chips are complex and bulky. In this article, a new wax valve design that uses light from a light emitting diode (LED) for both opening and closing is reported. The valves and a pumping chamber are integrated in lab-on-a-foil chips that can be fabricated at low cost using rapid prototyping techniques. A chip for the implementation of enzyme-linked immunosorbent assays (ELISA) is designed. A porous nitrocellulose material is used for the immobilization of capture antibodies in the microchannel. A compact generic instrument with an array of 64 LEDs, a linear actuator to drive the pumping chamber, and absorbance detection for a colorimetric readout of the assay is also presented. Characterization of all the components and functionalities of the platform and the designed chip demonstrate their potential for assay automation. Full article
(This article belongs to the Special Issue Microfluidics for Detection and Analysis)
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