Search Results (49)

This study investigates the performance of Cu-intercalated V₃O₇·H₂O (CuVOH) as a cathode material for aqueous zinc-ion batteries (AZIBs). Density Functional Theory (DFT) calculations were conducted to explore the effects of Cu²⁺ incorporation and structural water on the electrochemical performance of VOH. The results indicated that Cu²⁺ and structural water enhance Zn²⁺ diffusion by reducing electrostatic resistance and facilitating faster transport. Based on these insights, CuVOH nanobelts were synthesized via a one-step hydrothermal method. The experimental results confirmed the DFT predictions, demonstrating that CuVOH exhibited an initial discharge capacity of 336.1 mAh g⁻¹ at 0.2 A g⁻¹ and maintained a high cycling stability with 98.7% retention after 1000 cycles at 10 A g⁻¹. The incorporation of Cu²⁺ pillars and interlayer water improved the structural stability and Zn²⁺ diffusion, offering enhanced rate performance and long-term cycling stability. The study highlights the effective integration of computational and experimental methods to optimize cathode materials for high-performance AZIBs, providing a promising strategy for the development of stable and efficient energy storage systems. Full article

Aluminum recycling is a key pillar of sustainable metallurgy, protecting natural resources, reducing energy consumption by up to 15 times compared with primary aluminum production and significantly lowering the demand for raw materials. This article presents a comprehensive study on the impact of barbotage refining time and recycled scrap content on EN AC-46000 (AlSi9Cu3) alloy, covering the entire process from the initial ingot to the final casting, contributing to a circular economy. The input material consisted of varying proportions of pure ingots and scrap, with scrap content set at 80%, 70%, and 60%, respectively. Each material batch underwent different refining times: 0, 7, 9, and 15 min. Microstructural studies were conducted using light and scanning electron microscopy techniques. Additionally, pore distribution and their proportions within the material volume were analyzed using X-ray computed tomography. This study also examined hardness and gas content relative to the refining time. It was demonstrated that the refining process promoted microstructural homogenization and reduced porosity throughout the production process. Furthermore, extending the refining time positively impacted the reduction of porosity in thin-walled castings and lowered the gas emission level from the alloy, resulting in improved final product quality. Full article

Cu is a chemical contaminant that is toxic to aquatic animals at certain concentrations. The present study describes the gill transcriptome, proteome, and histology of the Chinese mitten crab (Eriocheir sinensis) subjected to copper stress. Female 14-month-old E. sinensis (n = 60) crabs (79.6 ± 4.8 g, body weight) were randomly divided into two groups and subjected to copper stress at concentrations of 0 μg/L (Blank group, GBL) and 50 μg/L (Copper group, GCP) for 96 h. In total, 278 upregulated and 189 downregulated differentially expressed genes (DEGs) were identified in the GBL and GCP groups. In addition, upregulated and downregulated differentially expressed proteins (DEPs) in the GBL and GCP groups were 260 and 308, respectively. An integrated analysis demonstrated that the three DEGs overlapped between the two omics approaches. Comparative omics analysis indicated that seven GO terms were significantly (p < 0.05) enriched by overlapping DEGs in the transcriptome and proteome. Further analysis revealed that only one overlapping DEG (stumps) was enriched in two common KEGG pathways, the PI3K-Akt and B cell receptor signaling pathways. Histological analyses showed that copper-stressed gills had collapsed lamellae with enlarged marginal vessels and shortened interlamellar spaces due to the disruption of the pillar cells and cuticles. These results demonstrate the variations in copper-stressed gills and will be helpful for better understanding the mechanisms of copper toxicity in E. sinensis. Full article

In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mechanical strength based on the laser irradiation time and laser power density. The growth of the intermetallic compound (IMC) in the joint cross-section was observed via FE-SEM analysis. Under optimized LAB conditions, minimal IMC growth and high bonding strength were achieved compared to conventional thermo-compression bonding (TCB) and mass reflow (MR) processes. As the laser irradiation time and laser power density increased, solder splashing was observed at bump temperatures above 300 °C. This is hypothesized to be due to the rapid temperature rise causing the flux to vaporize explosively, resulting in simultaneous solder splashing. With increasing laser power density, the failure mode transitioned from the solder to the IMC. Full article

Filling with phosphogypsum is one of the important ways to realize the sustainability development of phosphate mines. This study is based on the extensive on-site experiments conducted at the Dayukou phosphate mine. Over a period of 60 days, different proportions of phosphogypsum, cement, and mineral powder were used to fill the voids in the No. 1 and No. 2 test ore pillars. The results of strength testing during the experimental process indicate that the strength development of the filling material at various stages is normal, meeting all the requirements for mining production. The environmental protection monitoring station in the city conducted water quality analysis during the filling process, indicating that the concentrations of major elements such as Cu, Zn, Mn, Pb, Cd, and Hg in the water samples meet the industrial wastewater discharge standards. The fluoride content ranges from 3.28 to 6.90 mg/L, which is below the first-level standard of 10 mg/L specified in the “Comprehensive Wastewater Discharge Standards” (GB8978-1996). This suggests that the filling process has a minimal impact on the groundwater environment. After the completion of the filling, the pre-embedded pressure boxes function normally, and the data are generally stable, experiencing pressures ranging from 0.11 to 2.53 MPa. This on-site expanded trial indicates the feasibility of using cement, mineral powder, and phosphogypsum for underground filling. It demonstrates the potential for reutilizing the solid waste phosphogypsum as filling aggregate. Full article

Electroplating has become a cornerstone technology in semiconductor manufacturing, enabling high-performance interconnects and advanced packaging. Since the introduction of the Damascene Cu process at the 180 nm node, it has evolved to meet the demands for precision, uniformity, and scalability in miniaturized nodes and complex packaging architectures. The shift to horizontal electroplating systems has enhanced uniformity and process stability, particularly for applications such as TSVs, Cu pillars, micro-bumps, and RDLs. Emerging innovations like pulse electroplating, segmented anode control, and AI-driven monitoring are addressing the challenges of fine-pitch interconnects and emerging interconnect materials, such as cobalt. These advancements are critical for high-density interconnects used in AI, HPC, and high-frequency applications. This review explores the advancements in electroplating technologies, focusing on their role in semiconductor manufacturing. It highlights the evolving equipment designs and their implications for achieving precision, scalability, and reliability at advanced nodes. The ongoing development of electroplating equipment and techniques will support the reliability and performance of future semiconductor devices, reinforcing electroplating as a cornerstone technology in advanced packaging and fabrication. Full article

A montmorillonite sample was pillared using mixed solutions of Al/Cu and Al/Zn as the pillaring agent. Al/Cu- and Al/Zn-pillared clays were applied in an ethanol conversion reaction. The catalysts prepared from montmorillonite were characterized using X-ray diffraction (XRD), X-ray fluorescence (XRF), 27Al nuclear magnetic resonance spectroscopy (MAS-NMR), and textural analysis by adsorption of N₂. The synthesized materials showed basal spacing values around 1.6 nm for the Cu samples and 1.8 nm for the Zn samples. With the pillarization, textural properties such as specific area and micropore volume were optimized, and all samples showed an increase in micropore volume as well as a narrower pore distribution in the range of 0.77 nm. The insertion of 10% Zn in the pillaring solution produced a material with a greater amount of Al in the pentacoordinate position and also presented better results of conversion (80%) and selectivity to ethylene (81%) in the ethanol dehydration reaction. Full article

With the advancement of high-integration and high-density interconnection in chip manufacturing and packaging, Cu bumping technology in wafer- and panel- level packaging is developed to micrometer-sized structures and pitches to accommodate increased I/O numbers on high-end integrated circuits. Driven by this industrial demand, significant efforts have been dedicated to Cu electroplating techniques for improved pillar shape control and solder joint reliability, which substantially depend on additive formulations and electroplating parameters that regulate the growth morphology, crystal structure, and impurity incorporation in the process of electrodeposition. It is necessary to investigate the effect of an additive on Cu pillar electrodeposition, and to explore the Kirkendall voids formed during the reflowing process, which may result from the additive-induced impurity in the electrodeposited Cu pillars. In this work, a self-synthesized polyquaterntum (PQ) was made out with dual suppressor and leveler effects, and was combined with prototypical accelerator bis- (sodium sulfopropyl)-disulfide (SPS) for patterned Cu pillar electroplating. Then, Sn96.5/Ag3.0/Cu0.5 (SAC305) solder paste were screen printed on electroplated Cu pillars and undergo reflow soldering. Kirkendall voids formed at the joint interfaces were observed and quantified by SEM. Finally, XRD, and EBSD were employed to characterize the microstructure under varying conditions. The results indicate that PQ exhibits significant suppressive and levelled properties with the new structure of both leveler and suppressor. However, its effectiveness is dependent on liquid convection. PQ and SPS work synergistically, influencing the polarization effect in various convective environments. Consequently, uneven adsorption occurs on the surface of the Cu pillars, which results in more Kirkendall voids at the corners than at the center along the Cu pillar surface. Full article

Cu pillars serve as interconnecting structures for 3D chip stacking in heterogeneous integration, whose height uniformity directly impacts chip yield. Compared to typical methods such as white-light interferometry and confocal microscopy for measuring Cu pillars, microscopic fringe projection profilometry (MFPP) offers obvious advantages in throughput, which has great application value in on-line bump height measurement in wafer-level packages. However, Cu pillars with large curvature and smooth surfaces pose challenges for signal detection. To enable the MFPP system to measure both the top region of the Cu pillar and the substrate, which are necessary for bump height measurement, we utilized rigorous surface scattering theory to solve the bidirectional reflective distribution function of the Cu pillar surface. Subsequently, leveraging the scattering distribution properties, we propose a hybrid bright-dark-field MFPP system concept capable of detecting weakly scattered signals from the top of the Cu pillar and reflected signals from the substrate. Experimental results demonstrate that the proposed MFPP system can measure the height of Cu pillars with an effective field of view of 15.2 mm × 8.9 mm and a maximum measurement error of less than 0.65 μm. Full article

This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa. Full article

Environmental organo bentonite synthesis using curcumin-derived chemicals is used as catalyst support for zinc with a Zn-pillaring structure (Zn@CU/BEN). The obtained composite was assessed as an affordable, highly effective, and multifunctional photocatalyst for enhanced oxidation of ibuprofen (IBU) residuals in water supplies. The Zn@CU/BEN composite (0.4 g/L) displayed significant catalytic activities, resulting in the complete oxidation of IBU (25 mg/L) after 80 min. Then, the complete mineralization based on the full elimination of TOC content was recognized after 160 min, with significant indications about the formed intermediates. The identified intermediates, together with the identification of hydroxyl radicals as the essential oxidizing agent, declared an oxidation pathway of IBU over Zn@CU/BEN that involved three steps: hydroxylation, decarboxylation/demethylation, and ring-opening processes. The toxic properties of raw pollutants as well as the oxidizing product at different durations were assessed based on the cell viability results of kidney (HEK293T) and liver (HepG2) cell lines. The partially oxidized sample in the initial duration displayed a higher toxicity impact than the raw IBU. However, the treated sample after 160 min reflected high biosafety and non-toxic properties (cell viability > 97%). The synergetic impact of bentonite and bentonite organo-modified by curcumin extract reflects enhancements in the adsorption as well as the oxidation performance of pillared zinc as a catalyst. Full article

The fabrication of chitosan (CH) biocomposite beads with variable copper (Cu²⁺) ion doping was achieved with a glutaraldehyde cross-linker (CL) through three distinct methods: (1) formation of CH beads was followed by imbibition of Cu(II) ions (CH-b-Cu) without CL; (2) cross-linking of the CH beads, followed by imbibition of Cu(II) ions (CH-b-CL-Cu); and (3) cross-linking of pristine CH, followed by bead formation with Cu(II) imbibing onto the beads (CH-CL-b-Cu). The biocomposites (CH-b-Cu, CH-b-CL-Cu, and CH-CL-b-Cu) were characterized via spectroscopy (FTIR, ¹³C solid NMR, XPS), SEM, TGA, equilibrium solvent swelling methods, and phosphate adsorption isotherms. The results reveal variable cross-linking and Cu(II) doping of the CH beads, in accordance with the step-wise design strategy. CH-CL-b-Cu exhibited the greatest pillaring of chitosan fibrils with greater cross-linking, along with low Cu(II) loading, reduced solvent swelling, and attenuated uptake of phosphate dianions. Equilibrium and kinetic uptake results at pH 8.5 and 295 K reveal that the non-CL Cu-imbibed beads (CH-b-Cu) display the highest affinity for phosphate (Q_m = 133 ± 45 mg/g), in agreement with the highest loading of Cu(II) and enhanced water swelling. Regeneration studies demonstrated the sustainability and cost-effectiveness of Cu-imbibed chitosan beads for controlled phosphate removal, whilst maintaining over 80% regenerability across several adsorption–desorption cycles. This study offers a facile synthetic approach for controlled Cu²⁺ ion doping onto chitosan-based beads, enabling tailored phosphate oxyanion uptake from aqueous media by employing a sustainable polysaccharide biocomposite adsorbent for water remediation by mitigation of eutrophication. Full article

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency. Full article

Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology. In advanced packaging technology, copper–copper (Cu-Cu) bonding has become the preferred choice due to its excellent electrical and thermal properties. However, one of the major challenges of Cu-Cu bonding is the high thermal budget of the bonding process caused by Cu oxidation, which can result in wafer warpage and other back-end-of-line process issues in some cases. Thus, for specific applications, reducing the thermal budget and preventing Cu oxidation are important considerations in low-temperature hybrid bonding processes. This paper first reviews the advancements in low-temperature Cu-based bonding technologies for advanced packaging. Various low-temperature Cu-Cu bonding techniques such as surface pretreatment, surface activation, structure modification, and orientation control have been proposed and investigated. To overcome coplanarity issues of Cu pillars and insufficient gaps for filling, low-temperature Cu-Cu bonding used, but it is still challenging in fine-pitch applications. Therefore, low-temperature Cu/SiO₂, Cu/SiCN, and Cu/polymer hybrid bonding have been developed for advanced packaging applications. Furthermore, we present a novel hybrid bonding scheme for metal/polymer interfaces that achieves good flatness and an excellent bonding interface without the need for the chemical mechanical polishing (CMP) process. Full article

The Western Syncline hosts reduced-facies, or Kupferschiefer-type, sedimentary rock-hosted stratiform Cu deposits (SSC) in the lowermost meters of the Nonesuch Formation, which is part of a thick section of clastic sedimentary rocks that comprise the upper fill of the Mesoproterozoic Midcontinent Rift of North America. Located in the Porcupine Mountains Cu district in Upper Peninsula, Michigan, these blind deposits were discovered in 1956, but are not yet developed, although recent renewed interest may result in near-term production. The deposits are distinguished by their relatively undeformed nature and lack of superposed hydrothermal events. Prior to lithification, chalcocite mineralization replaced diagenetic pyrite within two discrete tabular, albeit discontinuous, potential orebodies referred to as the lower Cu-bearing sequence (LCBS) and the upper Cu-bearing sequence (UCBS). The Top Cu Zone transgresses lithologic boundaries, suggesting that a limited volume of Cu-bearing fluids moved vertically upwards through the unlithified stratigraphy, since reductant pyritic rocks above this zone are essentially barren of Cu. The total Cu inventory that has a reasonable expectation of economic extraction is 3678 M lbs. of Cu with 15.3 M oz. of byproduct Ag. When a cutoff grade of 0.9% Cu over a minimum thickness of 2 m is applied to justify an underground room-and-pillar mine, the LCBS and UCBS are not continuous over the Western Syncline. Sedimentology is the first-order control of potential ore and its continuity; dark-gray shales and siltstones deposited under low-energy, anoxic conditions are preferred host rocks, whose thickness must be >2 m to be potential ore since host-rock thickness determines economic viability of extraction. Furthermore, stratigraphy influences the time constraints on mineralization as the lithification process impedes vertical permeability and thus the flow of Cu-bearing fluids upward through the unlithified section. Syn-sedimentary tectonic movements, likely along pre-existing buried faults, are a third-order control as the thickness of host rocks is enhanced under such conditions. Therefore, an understanding of the depositional and tectonic history throughout the Western Syncline is fundamental to understanding the limits of possible economic exploitation and to optimizing ore extraction. Full article