Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 

Saved Queries

Sign in to use this feature.

Search Filter Reset All

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
Add Subjects Reset
Select Subjects

Journals

remove_circle_outline
remove_circle_outline
remove_circle_outline
Add Journals Reset
Select Journals

Article Types

remove_circle_outline
remove_circle_outline
Add Article Types Reset
Select Article Types

Countries / Regions

remove_circle_outline
Add Countries / Regions Reset
Select Countries / Regions
Update Search
share announcement

Search Results (6)

Search Parameters:
Authors = Sri Harini Rajendran

Order results
Result details
Results per page
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
29 pages, 54226 KiB  
Review
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
by Do Hoon Cho, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran and Jae Pil Jung
Metals 2021, 11(10), 1664; https://doi.org/10.3390/met11101664 - 19 Oct 2021
Cited by 42 | Viewed by 15053
Abstract
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via [...] Read more.
With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging. Full article
(This article belongs to the Special Issue Reliability Aspects of Lead-Free Solder Alloys Used in Electronics)
►▼ Show Figures

Figure 1

16 pages, 5696 KiB  
Article
Active Brazing of Alumina and Copper with Multicomponent Ag-Cu-Sn-Zr-Ti Filler
by Sri Harini Rajendran, Seung Jun Hwang and Jae Pil Jung
Metals 2021, 11(3), 509; https://doi.org/10.3390/met11030509 - 19 Mar 2021
Cited by 15 | Viewed by 5422
Abstract
The study was designed to investigate the synergic effect of Ti and Sn in the active metal brazing of Al2O3 ceramic to copper brazed, using the multicomponent Ag-Cu-Zr filler alloy. Numerous fine and hexagonal-shaped rod-like ternary intermetallic (Zr, Ti)5 [...] Read more.
The study was designed to investigate the synergic effect of Ti and Sn in the active metal brazing of Al2O3 ceramic to copper brazed, using the multicomponent Ag-Cu-Zr filler alloy. Numerous fine and hexagonal-shaped rod-like ternary intermetallic (Zr, Ti)5Sn3 phase (L/D = 5.1 ± 0.8, measured in microns) were found dispersed in the Ag-Cu matrix of Ag-18Cu-6Sn-3Zr-1Ti alloy, along with the ternary CuZrSn intermetallic phases. An approximate 15° reduction in contact angle and 3.1 °C reduction in melting point are observed upon the incorporation of Ti and Sn in Ag-18Cu-3Zr filler. Interestingly, the interface microstructure of Al2O3/Cu joints brazed by using Ag-18Cu-6Sn-3Zr-1Ti filler shows a double reaction layer: a discontinuous Ti-rich layer consisting of (Cu, Al)3(Ti, Zr)3O, TiO, and in-situ Cu-(Ti, Zr) precipitates on the Al2O3 side and continuous Zr-rich layer consisting of ZrO2 on the filler side. The shear strength achieved in Al2O3/Cu joints brazed with Ag-18Cu-6Sn-3Zr-1Ti filler is 31% higher, compared to the joints brazed with Ag-18Cu-6Sn-3Zr filler. Failure analysis reveals a composite fracture mode indicating a strong interface bonding in Al2O3/Ag-18Cu-6Sn-3Zr-1Ti filler/Cu joints. The findings will be helpful towards the development of high entropy brazing fillers in the future. Full article
►▼ Show Figures

Figure 1

25 pages, 5258 KiB  
Review
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
by Hyejun Kang, Sri Harini Rajendran and Jae Pil Jung
Metals 2021, 11(2), 364; https://doi.org/10.3390/met11020364 - 22 Feb 2021
Cited by 83 | Viewed by 18599
Abstract
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of [...] Read more.
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed. Full article
(This article belongs to the Special Issue Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging)
►▼ Show Figures

Figure 1

17 pages, 8141 KiB  
Article
Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles
by Sri Harini Rajendran, Seung Jun Hwang and Jae Pil Jung
Metals 2020, 10(10), 1295; https://doi.org/10.3390/met10101295 - 28 Sep 2020
Cited by 33 | Viewed by 6313
Abstract
This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by [...] Read more.
This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging. Full article
(This article belongs to the Special Issue Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging)
►▼ Show Figures

Graphical abstract

10 pages, 3695 KiB  
Article
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
by Sri Harini Rajendran, Jung Do Hyun, Jeon Wook Sang and Jung Jae Pil
Appl. Sci. 2019, 9(3), 529; https://doi.org/10.3390/app9030529 - 4 Feb 2019
Cited by 13 | Viewed by 5027
Abstract
In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of [...] Read more.
In this paper, a novel transient liquid phase bonding material was fabricated by consequent electroless plating of Cu and Sn on a multi-walled carbon nanotube (MWCNT). The resulting Sn-Cu-MWCNT composites were used to join the Cu interconnects at 260°C. After 8 min of reflow time, a complete transformation of Cu3Sn intermetallic compound (IMC) occurred, leaving a Cu/MWCNT-Cu3Sn /Cu joint capable of withstanding the high operating temperature. Due to flake-like morphology, the Sn-Cu-MWCNT composite particles were well packed with lesser voids. The shear strength of the Cu/Cu3Sn-MWCNT/Cu joint was measured as 35.3 MPa, thus exhibiting the scope for replacing conventional transient liquid phase (TLP) powders in the future. Full article
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
►▼ Show Figures

Graphical abstract

18 pages, 6943 KiB  
Article
Effect of ZrO2 Nanomaterials on Wettability and Interfacial Characteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing
by Do-Hyun Jung, Sri Harini Rajendran and Jae-Pil Jung
Nanomaterials 2018, 8(10), 784; https://doi.org/10.3390/nano8100784 - 3 Oct 2018
Cited by 3 | Viewed by 4030
Abstract
Dissimilar Al 3003 and Cu tubular components were successfully brazed without interface cracking using ZrO2 nanomaterials reinforced with Al-19Cu-11Si-2Sn filler. The filler was initially cast using an induction furnace and processed into ring form for brazing. Al-19Cu-11Si-2Sn filler with coarse CuAl2 [...] Read more.
Dissimilar Al 3003 and Cu tubular components were successfully brazed without interface cracking using ZrO2 nanomaterials reinforced with Al-19Cu-11Si-2Sn filler. The filler was initially cast using an induction furnace and processed into ring form for brazing. Al-19Cu-11Si-2Sn filler with coarse CuAl2 and Si phases (43 and 20 μm) were refined to 8 and 4 μm, respectively, after the addition of 0.1 wt. % ZrO2 and shows significant improvement in the mechanical properties. ZrO2 nanomaterials’ induced diffusion controlled growth mechanism is found be the responsible for the refinement of CuAl2 intermetallic and Si particles. The wettability of Al-19Cu-11Si-2Sn-0.1ZrO2 increased to 78.17% on Cu side and 93.19% on the Al side compared from 74.8% and 89.9%, respectively. Increase in the yield strength, ultimate tensile strength, and percentage elongation were noted for the brazed joints. Microstructure of induction brazed joint with 40 kW for 6 seconds using Al-19Cu-11Si-2Sn-0.1ZrO2 filler shows thin interfacial CuAl2 intermetallic compound along the copper side and inter-diffusion region along the aluminum side and their respective mechanism is discussed. The tensile strength of the joints increased with increasing the nanomaterials addition and shows a base metal fracture. Analysis of fractured samples shows the effectiveness of ZrO2 reinforced filler in crack propagation through the filler. Full article
►▼ Show Figures

Graphical abstract

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying article 1-50 on page 1 of 1.
Back to TopTop