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Authors = Gunther Roelkens

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14 pages, 4903 KiB  
Article
A Miniaturised, Fully Integrated NDIR CO2 Sensor On-Chip
by Xiaoning Jia, Joris Roels, Roel Baets and Gunther Roelkens
Sensors 2021, 21(16), 5347; https://doi.org/10.3390/s21165347 - 8 Aug 2021
Cited by 46 | Viewed by 7417
Abstract
In this paper, we present a fully integrated Non-dispersive Infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor is based on an integrating cylinder with access waveguides. A mid-IR LED is used as the optical source, and two mid-IR photodiodes [...] Read more.
In this paper, we present a fully integrated Non-dispersive Infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor is based on an integrating cylinder with access waveguides. A mid-IR LED is used as the optical source, and two mid-IR photodiodes are used as detectors. The fully integrated sensor is formed by wafer bonding of two silicon substrates. The fabricated sensor was evaluated by performing a CO2 concentration measurement, showing a limit of detection of ∼750 ppm. The cross-sensitivity of the sensor to water vapor was studied both experimentally and numerically. No notable water interference was observed in the experimental characterizations. Numerical simulations showed that the transmission change induced by water vapor absorption is much smaller than the detection limit of the sensor. A qualitative analysis on the long term stability of the sensor revealed that the long term stability of the sensor is subject to the temperature fluctuations in the laboratory. The use of relatively cheap LED and photodiodes bare chips, together with the wafer-level fabrication process of the sensor provides the potential for a low cost, highly miniaturized NDIR CO2 sensor. Full article
(This article belongs to the Section Optical Sensors)
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14 pages, 1846 KiB  
Article
On-Chip Non-Dispersive Infrared CO2 Sensor Based on an Integrating Cylinder †
by Xiaoning Jia, Joris Roels, Roel Baets and Gunther Roelkens
Sensors 2019, 19(19), 4260; https://doi.org/10.3390/s19194260 - 30 Sep 2019
Cited by 36 | Viewed by 6737
Abstract
In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides. A detailed analysis of the proposed sensor [...] Read more.
In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides. A detailed analysis of the proposed sensor is presented. Simulation with 3D ray tracing shows that an integrating cylinder with 4 mm diameter gives an equivalent optical path length of 3.5 cm. The sensor is fabricated using Deep Reactive Ion Etching (DRIE) and wafer bonding. The fabricated sensor was evaluated by performing a CO2 concentration measurement, showing a limit of detection of ∼100 ppm. The response time of the sensor is only ∼2.8 s, due to its small footprint. The use of DRIE-based waveguide structures enables mass fabrication, as well as the potential co-integration of flip-chip integrated midIR light-emitting diodes (LEDs) and photodetectors, resulting in a compact, low-power, and low-cost NDIR CO2 sensor. Full article
(This article belongs to the Section Optical Sensors)
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21 pages, 16366 KiB  
Review
III–V-on-Silicon Photonic Integrated Circuits for Spectroscopic Sensing in the 2–4 μm Wavelength Range
by Ruijun Wang, Anton Vasiliev, Muhammad Muneeb, Aditya Malik, Stephan Sprengel, Gerhard Boehm, Markus-Christian Amann, Ieva Šimonytė, Augustinas Vizbaras, Kristijonas Vizbaras, Roel Baets and Gunther Roelkens
Sensors 2017, 17(8), 1788; https://doi.org/10.3390/s17081788 - 4 Aug 2017
Cited by 83 | Viewed by 24103
Abstract
The availability of silicon photonic integrated circuits (ICs) in the 2–4 μm wavelength range enables miniature optical sensors for trace gas and bio-molecule detection. In this paper, we review our recent work on III–V-on-silicon waveguide circuits for spectroscopic sensing in this wavelength range. [...] Read more.
The availability of silicon photonic integrated circuits (ICs) in the 2–4 μm wavelength range enables miniature optical sensors for trace gas and bio-molecule detection. In this paper, we review our recent work on III–V-on-silicon waveguide circuits for spectroscopic sensing in this wavelength range. We first present results on the heterogeneous integration of 2.3 μm wavelength III–V laser sources and photodetectors on silicon photonic ICs for fully integrated optical sensors. Then a compact 2 μm wavelength widely tunable external cavity laser using a silicon photonic IC for the wavelength selective feedback is shown. High-performance silicon arrayed waveguide grating spectrometers are also presented. Further we show an on-chip photothermal transducer using a suspended silicon-on-insulator microring resonator used for mid-infrared photothermal spectroscopy. Full article
(This article belongs to the Special Issue Silicon Technologies for Photonic Sensors)
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36 pages, 2350 KiB  
Review
III-V-on-Silicon Photonic Devices for Optical Communication and Sensing
by Gunther Roelkens, Amin Abassi, Paolo Cardile, Utsav Dave, Andreas De Groote, Yannick De Koninck, Sören Dhoore, Xin Fu, Alban Gassenq, Nannicha Hattasan, Qiangsheng Huang, Sulakshna Kumari, Shahram Keyvaninia, Bart Kuyken, Lianyan Li, Pauline Mechet, Muhammad Muneeb, Dorian Sanchez, Haifeng Shao, Thijs Spuesens, Ananth Z. Subramanian, Sarah Uvin, Martijn Tassaert, Kasper Van Gasse, Jochem Verbist, Ruijun Wang, Zhechao Wang, Jing Zhang, Joris Van Campenhout, Xin Yin, Johan Bauwelinck, Geert Morthier, Roel Baets and Dries Van Thourhoutadd Show full author list remove Hide full author list
Photonics 2015, 2(3), 969-1004; https://doi.org/10.3390/photonics2030969 - 18 Sep 2015
Cited by 130 | Viewed by 26012
Abstract
In the paper, we review our work on heterogeneous III-V-on-silicon photonic components and circuits for applications in optical communication and sensing. We elaborate on the integration strategy and describe a broad range of devices realized on this platform covering a wavelength range from [...] Read more.
In the paper, we review our work on heterogeneous III-V-on-silicon photonic components and circuits for applications in optical communication and sensing. We elaborate on the integration strategy and describe a broad range of devices realized on this platform covering a wavelength range from 850 nm to 3.85 μm. Full article
(This article belongs to the Special Issue Hybrid and Heterogeneous Technologies in Photonics Integrated Circuits)
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21 pages, 956 KiB  
Review
Hybrid Integrated Platforms for Silicon Photonics
by Di Liang, Gunther Roelkens, Roel Baets and John E. Bowers
Materials 2010, 3(3), 1782-1802; https://doi.org/10.3390/ma3031782 - 12 Mar 2010
Cited by 285 | Viewed by 29007
Abstract
A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues [...] Read more.
A review of recent progress in hybrid integrated platforms for silicon photonics is presented. Integration of III-V semiconductors onto silicon-on-insulator substrates based on two different bonding techniques is compared, one comprising only inorganic materials, the other technique using an organic bonding agent. Issues such as bonding process and mechanism, bonding strength, uniformity, wafer surface requirement, and stress distribution are studied in detail. The application in silicon photonics to realize high-performance active and passive photonic devices on low-cost silicon wafers is discussed. Hybrid integration is believed to be a promising technology in a variety of applications of silicon photonics. Full article
(This article belongs to the Special Issue Inorganic-Organic Hybrid Materials)
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