Thermo-mechanical Processing of Metals and Alloys

Special Issue Editor


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Guest Editor
Department of Mechanical and Aerospace Engineering Carleton University, Ottawa, ON K1S 5B6, Canada
Interests: physical metallurgy of structural metals; thermo-mechanical processing; mechanical testing; materials characterization; industrial manufacturing processes; additive manufacturing; welding and joining

Special Issue Information

Dear Colleagues:

Thermo-mechanical processing can be defined as an engineering process that involves a combination of deformation, heating, and cooling cycles. The final mechanical properties of a structural component are directly linked to the microstructure. This microstructure is heavily dependent on external processing parameters such as temperature, strain, strain rate, deformation mode, etc. Therefore, the role of microstructure evolution during thermo-mechanical processing is highly critical for understanding the processing–property correlations. The modern manufacturing industry requires thermo-mechanical processes not only to obtain a final component with precision dimensional accuracy, but also to accomplish the optimum mechanical and physical properties.

The scope of this Special Issue includes (but is not limited to):

  • Uniaxial tension and compression testing (hot/cold);
  • Industrial deformation processes of metallic materials (rolling, forging, extrusion, drawing, hydroforming, hipping, severe plastic deformation, etc.);
  • Post-process heat treatments;
  • Defects associated with the processing;
  • Phase transformation during or after the process;
  • Recovery, recrystallization (dynamic and static) and grain growth associated with the deformation process;
  • Textural developments during thermo-mechanical processing;
  • Microstructure–mechanical properties—processing correlations.

Dr. Abu Syed Kabir
Guest Editor

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Keywords

  • microstructure
  • deformation
  • phase transformation
  • mechanical properties
  • texture
  • heat treatment

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Published Papers

There is no accepted submissions to this special issue at this moment.
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