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Journal: Chips, 2025
Volume: 4
Number: 32

Article: Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane
Authors: by Sander Reniers, Yi Wang, Salim Abdi, Jasper de Graaf, Aleksandr Zozulia, Kevin Williams and Yuqing Jiao
Link: https://www.mdpi.com/2674-0729/4/3/32

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