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Journal: Chips, 2025
Volume: 4
Number: 32
Article:
Highly Versatile Photonic Integration Platform on an Indium Phosphide Membrane
Authors:
by
Sander Reniers, Yi Wang, Salim Abdi, Jasper de Graaf, Aleksandr Zozulia, Kevin Williams and Yuqing Jiao
Link:
https://www.mdpi.com/2674-0729/4/3/32
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