Recent Advances in Digital Fringe Projection Profilometry (2022–2025): Techniques, Applications, and Metrological Challenges—A Review
Abstract
1. Introduction
2. Fundamental Principles of DFPP
2.1. Optical Triangulation and Geometric Foundations
2.2. Fringe Formation, Phase Encoding, and Phase Extraction
2.3. Phase Unwrapping, Ambiguity Resolution, and Metrological Sensitivity
3. System Components and Architecture
3.1. Projection Technologies
3.2. Imaging Sensors
3.3. Geometric Configurations
3.4. Optical Design and Metrological Constraints
3.5. Synchronization and Timing
3.6. Calibration
4. Phase Processing Techniques
4.1. Phase Acquisition and Extraction
4.1.1. Phase-Shifting Profilometry (PSP)
4.1.2. Fourier Transform Profilometry (FTP)
4.1.3. Hybrid and Adaptive Methods
4.2. Phase Unwrapping Methods
4.2.1. Temporal Phase Unwrapping (TPU)
4.2.2. Spatial Phase Unwrapping (SPU)
4.2.3. Hybrid Temporal–Spatial Approaches
4.3. Single-Shot and Multi-Shot Approaches
4.3.1. Single-Shot Methods
4.3.2. Multi-Shot Optimization
5. Applications and Case Studies
5.1. Industrial and Aerospace Applications
5.2. Biomedical and Healthcare Applications
5.3. Cultural Heritage and Specialized Applications
5.4. Microscale, Materials, and Scientific Applications
6. Current Challenges and Future Perspectives
6.1. Technical Limitations and Solutions
6.1.1. Environmental Sensitivity and Robustness
6.1.2. Challenging Surface Properties
6.1.3. Computational Complexity and Real-Time Processing
6.1.4. Accuracy, Precision, and Error Propagation
6.2. Emerging Trends and Technologies
6.2.1. Artificial Intelligence and Deep Learning Integration
6.2.2. Miniaturization and Portable Systems
6.2.3. Multi-Modal and Hybrid Systems
6.2.4. Edge and Cloud Computing Architectures
6.2.5. Standardization and Open Ecosystems
6.3. Future Research Directions
6.3.1. Short- to Mid-Term Developments
Algorithmic Advances
Hardware and System Integration
Application-Driven Developments
6.3.2. Long-Term and Transformative Directions
Autonomous and Self-Optimizing Systems
Advanced Physical Principles
Extreme Environment and Multi-Scale Applications
7. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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| Technology | Contrast | Refresh Rate | Resolution | Metrological Strengths |
|---|---|---|---|---|
| DLP | 2000:1–5000:1 | Up to ∼10 kHz | HD–2K | High SNR, dynamic scenes, industrial robustness |
| LCD | 1000:1–2000:1 | 60–240 Hz | HD–4K | Low cost, smooth grayscale modulation |
| LCoS | ≥3000:1 | 60–120 Hz | 2K–4K | Maximal fidelity, microscale measurement |
| Binary/MEMS | High (binary) | >10 kHz | Varies | Ultra-fast, resistant to nonlinearities |
| Sensor Type | Strengths | Limitations | Applications + References |
|---|---|---|---|
| CCD | Low noise, high QE, uniform pixels | Low speed, high power | Microscale, holography [52,54] |
| CMOS | High speed, low cost, integrated ADC | Higher pixel noise | Dynamic 3D imaging [55,57] |
| 3CCD/HYBRID | No crosstalk, high color fidelity | Cost, complexity | Shape + deformation [54] |
| TDI | High sensitivity at speed | Complex optics | Industrial inspection [59] |
| Configuration | Advantages | Limitations | Applications | Precision |
|---|---|---|---|---|
| Monocular | Compact, low cost | Occlusions, reflectance sensitivity | Education, small objects | 10–50 m |
| Binocular | Better robustness, stereo fusion | More calibration steps | Industrial inspection | 5–20 m |
| Multi-projector | Minimal shadows, full coverage | Sync complexity | Complex shapes | 1–10 m |
| Optics | Strengths | Limitations | Precision | Use Cases |
|---|---|---|---|---|
| Conventional | Flexible FOV | Distortion | 10–100 m | General |
| Telecentric | Constant magnification, no perspective distortion | Narrow FOV | 1–10 m | Precision metrology |
| Scheimpflug | Large DOF | Complex geometry | 5–20 m | Large objects |
| Multi-axis | Occlusion-free | Calibration-heavy | 1–5 m | Industrial/robotics |
| Category | Key Characteristics + Representative Works |
|---|---|
| Iterative/Optimization | Robust under noise; convergence guarantees for specific domains; widely applicable in optics and signal processing [72,73,74]. |
| Deep Learning/Diffusion | High reconstruction fidelity; strong robustness; direct wrapped-to-unwrapped prediction; discontinuity learning [75,76,97,98,100]. |
| Temporal/Multi-Frequency | Ambiguity removal via frequency hierarchy; strong performance in dynamic measurement and long-range metrology [85,86,93,94]. |
| Hybrid/Quality-Guided | Combined spatial–temporal reliability; improved tolerance to residues, low-SNR, and discontinuities [89,90,95,96]. |
| Spatial Classical Methods | Path-following and minimum-norm solvers; well-established; sensitive to noise and discontinuities [87,88,91]. |
| Quantum/Advanced Optimization | Global optimization for noisy interferometry; emerging technology [77,102]. |
| Application Domain | Key Use Cases + Representative Works |
|---|---|
| Industrial & Aerospace | In-line inspection, AM process monitoring, reflective surface metrology, turbine blade measurement, multi-view inspection, robotic vision integration. [133,134,135,136,137] [65,138,139,140] [29,141] |
| Biomedical & Healthcare | Intraoral scanning, surgical planning (VSP), orthodontic design, implant guidance, tissue and biomechanics analysis, gait and posture assessment, personalized implants. [142,143,144] [145,146,147,148] [149,150] |
| Cultural Heritage | High-resolution digitization of artifacts, paintings, and manuscripts; microcrack detection; multi-view scanning, underwater and field documentation, preservation of fragile objects. [151,152,153] [154,155,156] |
| Microscale & Materials | MEMS inspection, semiconductor metrology, PCB analysis, reflective metal measurement, HDR and crosstalk mitigation, deep-learning single-shot microscale reconstruction. [37,157,158,159] [28,160,161,162,163] |
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Sanchez-Torres, M.; Hernández-Capuchin, I.; Ramírez-Fernández, C.; Clemente, E.; Sánchez-González, J.L.J.; López-Martínez, A. Recent Advances in Digital Fringe Projection Profilometry (2022–2025): Techniques, Applications, and Metrological Challenges—A Review. Metrology 2026, 6, 3. https://doi.org/10.3390/metrology6010003
Sanchez-Torres M, Hernández-Capuchin I, Ramírez-Fernández C, Clemente E, Sánchez-González JLJ, López-Martínez A. Recent Advances in Digital Fringe Projection Profilometry (2022–2025): Techniques, Applications, and Metrological Challenges—A Review. Metrology. 2026; 6(1):3. https://doi.org/10.3390/metrology6010003
Chicago/Turabian StyleSanchez-Torres, Mishraim, Ismael Hernández-Capuchin, Cristina Ramírez-Fernández, Eddie Clemente, José Luis Javier Sánchez-González, and Alan López-Martínez. 2026. "Recent Advances in Digital Fringe Projection Profilometry (2022–2025): Techniques, Applications, and Metrological Challenges—A Review" Metrology 6, no. 1: 3. https://doi.org/10.3390/metrology6010003
APA StyleSanchez-Torres, M., Hernández-Capuchin, I., Ramírez-Fernández, C., Clemente, E., Sánchez-González, J. L. J., & López-Martínez, A. (2026). Recent Advances in Digital Fringe Projection Profilometry (2022–2025): Techniques, Applications, and Metrological Challenges—A Review. Metrology, 6(1), 3. https://doi.org/10.3390/metrology6010003

