Gu, M.; Chae, S.; Kim, S.; Kim, Y.; Kang, S.; Park, S.; Park, S.-H.; Choa, S.-H.; Nam, H.
High-Performance EMI Shielding Film Based on Low-Dk Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement. Micro 2025, 5, 26.
https://doi.org/10.3390/micro5020026
AMA Style
Gu M, Chae S, Kim S, Kim Y, Kang S, Park S, Park S-H, Choa S-H, Nam H.
High-Performance EMI Shielding Film Based on Low-Dk Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement. Micro. 2025; 5(2):26.
https://doi.org/10.3390/micro5020026
Chicago/Turabian Style
Gu, Moses, Suin Chae, Seonwoo Kim, Yubin Kim, Shinui Kang, Soobin Park, Se-Hoon Park, Sung-Hoon Choa, and Hyunjin Nam.
2025. "High-Performance EMI Shielding Film Based on Low-Dk Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement" Micro 5, no. 2: 26.
https://doi.org/10.3390/micro5020026
APA Style
Gu, M., Chae, S., Kim, S., Kim, Y., Kang, S., Park, S., Park, S.-H., Choa, S.-H., & Nam, H.
(2025). High-Performance EMI Shielding Film Based on Low-Dk Polyimide and Trimodal Ag Ink for High-Speed Signal Integrity Enhancement. Micro, 5(2), 26.
https://doi.org/10.3390/micro5020026