Low-Current High-Voltage Vortex-Stabilized Pulsed Arc Atmospheric-Pressure Plasma Jets: Processes and Processing
Abstract
1. Introduction
- The discharge geometry, electrode arrangement, and field configuration; in our case, coaxial electrodes with a central active electrode (cathode, anode, or bipolar-biased) and a grounded nozzle, with no external magnetic field. This classification scheme does not explicitly consider the stabilization of the arc by a gas-flow vortex, which is crucial for the arc discharges under consideration. We propose the assignment of the type of gas vortex flow stabilization to the “discharge geometry”-criterion.
- The type of plasma, which is generated; in our case, the non-thermal, low-current high-voltage (LCHV) arc and its gaseous products (plasma plume).
- The excitation frequency and excitation pattern. In our case, excitation by kHz-power, mostly DC-pulsed but also AC.
- The type of gas or combination of gases injected to the discharge arrangement; in our case, air (synthetic or CDA), nitrogen, nitrogen–hydrogen mixtures, argon–molecular gas mixtures, and other mainly molecular mixtures. In many cases, in parallel to the ionization gas needed for arc generation, the additional gas, vapor, suspension, or mist is introduced either in the arc or into the plasma plume.
2. Atmospheric-Pressure Arcs
2.1. Thermal Equilibrium
2.2. Specific Energy Input
2.3. Thermal Atmospheric Arcs
2.3.1. First DC Arcs
2.3.2. DC Arc Torches
2.3.3. Plasma Arc Welding and Cutting
2.3.4. DC Arc Plasma Spraying
2.4. Gliding Arc Discharge
2.4.1. 2D GADs
2.4.2. Pulsed GAD
2.4.3. Cascaded Pulsed GAD
2.4.4. 3D GADs
2.4.5. Forward Vortex Flow GAD
- I.
- An arc ignites along the shortest path between the anode and cathode and rotates (or not) there, because the vortex flow is too weak to transfer it further.
- II.
- A gliding arc rapidly extends along a spiral trajectory from the closest gap between the electrodes to the tip of the conical high-voltage electrode, where the arc is disrupted, and the process repeats.
- III.
- The arc is anchored between the tip of the high-voltage electrode and the nozzle throat, resulting in a constant arc column length.
- IV.
- It can be seen as a high-SEI condition, where the arc is developed beyond the nozzle throat or driven out of it.
- V.
- The main differences between this arc mode and mode IV are that the arc does not bend back to the nozzle or torch wall, and that it is attached to the grounded substrate outside the torch and rotates there, or not. The diffuse plasma is produced at the substrate surface.
2.4.6. Reverse Vortex Flow GAD
2.4.7. Gliding Arc Discharge APPJ
2.5. Low-Current High-Voltage Arc Atmospheric-Pressure Plasma Jet
3. Processes in ∗JETs
3.1. Structure of the ∗JET Plasma
3.1.1. Diffuse Plasma
3.1.2. Influence of Nozzle Shape on Plasma Plume
3.1.3. Hybrid Plasma Plume
3.1.4. Transferred Arc
3.1.5. Plasma Bridge
3.2. Plasma Plume Thermal Characteristics
3.2.1. Temperature
3.2.2. Energy Flux
3.2.3. Temperature Measurement by OES
3.2.4. Density Gradients
3.2.5. Acoustic Emissions
3.3. Arc Dynamics
3.3.1. Modulation of Arc Luminosity
3.3.2. Arc Foot Rotation
3.3.3. Discharge Stability
3.3.4. Influence of Magnetic Field
3.4. Electron Concentration in ∗JET
3.5. Electric Characterisation
3.5.1. I–V-Measurements
3.5.2. The Single Pulse
3.5.3. Frequency Dependence of Arc Current and Voltage
3.5.4. Frequency Spectrum
3.6. Erosion of Electrodes
3.6.1. Anode Erosion
3.6.2. Cathode Erosion
3.6.3. Microparticle Emission
3.6.4. Nanoparticle Emission
3.7. Plasma Plume Chemistry
3.7.1. Long-Lived Species
3.7.2. Optical Emission Spectroscopy
3.7.3. Influence of Nozzle Material
3.8. Operation in Different Gases
3.8.1. Air
3.8.2. Nitrogen
3.8.3. Hydrogen in Nitrogen
3.8.4. Hydrogen in Argon
3.8.5. Other Molecular Gases
3.9. Reduced Pressure Operation
3.10. Applicability of Numerical Modeling
3.10.1. Global Models
3.10.2. Multidimensional Modeling
3.10.3. Assumption of Local Thermal Equilibrium
3.10.4. Computational Fluid Dynamics
3.10.5. Hybrid Simulation
3.10.6. Arc–Electrode Interactions
3.10.7. Prediction of Processing Result
4. Processing
4.1. ∗JET Dynamics
4.1.1. Plasma Pulses
4.1.2. Fast Moving ∗JET
4.1.3. Fast-Moving Substrates
4.2. Wide-Surface Treatment
4.2.1. Matrix of ∗JETs
4.2.2. Flat Nozzles
4.2.3. Rotation Nozzle
4.3. Surface Activation
4.3.1. Polymers
4.3.2. Tiny Structures
4.3.3. Carbon Fiber Reinforced Polymers
4.3.4. Glass-Fiber-Reinforced Polymers
4.3.5. Composites of Plastics with Natural Fibers
4.3.6. Application of Nitrogen
4.4. Surface Cleaning
4.5. Oxide Reduction
4.5.1. Copper Oxide Reduction
4.5.2. Reduction in Copper Contact Pads
4.5.3. Silver Oxide Reduction
4.5.4. Silver Oxide Reduction at Reduced Pressure
4.5.5. Reduction of Other Materials
4.6. Structural Surface Modification
4.6.1. Etching
4.6.2. Texturing
4.6.3. Increasing the Metal Surface Roughness
4.6.4. Metal Oxidation
4.6.5. Nitriding
- It is possible, using a ∗JET plasma generator, to produce several thicknesses of μm thick nitride films on different steels, titanium, and titanium alloys.
- Good results are obtained with nitrogen with a small admixture of hydrogen, which improves the diffusion properties of nitrogen.
- The percentage of hydrogen is critical for achieving specific surface properties. It ranges from 1 to 5% in the literature.
- Strong influence on the film properties has the composition of the ambient atmosphere. The best results are obtained with an oxygen-free ambient.
- The elevated temperature increases the processing speed. The enhancement in the natural plasma jet heat deposition by a plate heater or by an IR heater is reported.
- The plasma treatment in arc transferred operation mode is a prerequisite for efficient nitriding.
4.6.6. Thin Film Conversion
4.6.7. Rapid Spraying Plasma Processing
4.7. Thermoelectric Removal
4.7.1. Copper Swarf Removal
4.7.2. Depainting
| Parameter | Al Sheet | Steel Wire | EPD | CFRP Coupon |
|---|---|---|---|---|
| substrate material | Al sheet | steel wire | Al sheet | CFRP |
| substrate holder | Al block | steel clamp | Al block | Cu plate |
| HV pulse frequency | 62 kHz | 62 kHz | 63 kHz | 62 kHz |
| power | 2 kW | 2 kW | 1 kW | 1 kW |
| ionization gas | CDA | CDA | CDA | |
| gas flow | 70 SLM | 50 SLM | 60 SLM | 40 SLM |
| nozzle-substrate distance | 3 mm | 3 mm | 2 mm | 3 mm |
| space between tracks | 1 mm | 1 mm | 1 mm | 1 mm |
| the length of the trace | 140 mm | 140 mm | 130 mm | 130 mm |
| jet movement speed | 51 mm/s | 20 mm/s | 45 mm/s | 75 mm/s |
| nuber of runs | 1 | 2 | 15 | 1 |
4.7.3. Removal of EPD Coating
4.7.4. Paint Removal from CFRP-Coupons
4.8. Low-Temperature Plasma Spraying
4.8.1. LTPS Principle
4.8.2. Plasmadust
4.8.3. Copper Particles’ Stream Characterization
- The size (mass and surface area) distribution of the copper particles. Small particles heat up faster than the large ones.
- The velocity differences at different points of the powder injection into the arc, resulting in different heating times of the particles.
- The radial distribution of the temperature in the arc channel.
- The modulation of the discharge power due to the pulsing current flowing through the arc.
- Different speeds of particles in the cooling zone.
4.8.4. Plasma Fluxing for Soldering
4.8.5. Plasma Fluxing for Brazing
4.8.6. Deposition of Polymer Films
4.8.7. Suspension Plasma Spraying
4.9. AP-PECVD
4.9.1. Physical Limitations of AP-PECVD
4.9.2. Silica-like Films
| Processing Parameters | Units | AcXys-ULS [170] | OpenAir [152] | PB3 [530] |
|---|---|---|---|---|
| Monomer | Cu()2 | HMDSO | Ti()4 | |
| Precursor flow rate | – | 3–5 | ||
| Discharge power | W | 900–1100 | 500–750 | 2000 W |
| Carrier gas | ||||
| Carrier gas flow rate | 3–11 | 7 | 14 | |
| Plasma gas | CDA | CDA | ||
| Plasma gas flow rate | 30–50 | 8 | 60 | |
| Nozzle-substrate distance | mm | 30–50 | 30 | 24 |
| Relative jet speed | 30–60 | 17 | 40–80 | |
| Substrate material | Si-wafers | aluminum | beech wood |
4.9.3. Titania-like Films
4.9.4. Metal Compounds
4.9.5. Plasma–Polymer Films
4.10. Biological Decontamination
4.10.1. Gas Phase Treatment
4.10.2. Plasma-Activated Water
4.10.3. Wastewater Utilization
5. Conclusions
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
Abbreviations
| AC | Alternating current | LIF | Laser-induced fluorescence |
| AFM | Atomic force microscopy | LTE | Local thermal equilibrium |
| APL | Acoustic pressure level | LTPS | Low-temperature plasma spraying |
| APP | Atmospheric-pressure plasma | MDF | Medium-density fibreboard |
| APPJ | Atmospheric-pressure plasma jet | MFC | Mass flow controller |
| CCP | Capacitively coupled plasma | NIR | Near-infrared |
| CDA | Compressed (or clean) dried air | NP | Nanoparticle |
| CFC | Clorfluorcarbone | OMCTS | Octamethylcyclotetrasiloxane |
| CFD | Computational fluid dynamics | PAA | Pulsed atmospheric arc |
| CFRP | Carbon fiber reinforced polymer | PAC | Plasma arc cutting |
| CNT | Carbon nanotubes | PAL | plasma activated liquid |
| COC | Cycloolefin copolymer | PAW | plasma activated water |
| COD | Chemical oxygen demand | PCB | Printed circuit boards |
| CVD | Chemical vapor deposition | PDD | Piezoelectric direct discharge |
| DBD | Dielectric barrier discharge | PECVD | Plasma enhanced CVD |
| DC | Direct current | PEEK | Poly(ether ether ketone) |
| DLC | Diamond-like carbon | PPA | Polyphthalamide |
| DSSC | Dye-sensitized solar cells | PPS | Poly(phenylene) sulphide |
| EDS,EDX | Energy-dispersive X-ray spectroscopy | PSA | Pressure sensitive adhesive |
| EEDF | Electron energy distribution function | PVDF | Polyvinylidenefluoride |
| EIS | Electrochemical impedance spectroscopy | PWM | Pulse width modulation |
| EMC | Electromagnetic compatibility | RF | Radio frequency |
| ENIG | Electroless nickel/immersion gold | rGO | Reduced graphene oxide |
| EPD | Electrophoretic deposition | ROS | Reactive oxygen species |
| ESD | Electrostatic discharge | RONS | Reactive oxygen–nitrogen species |
| FEM | Finite Element Method | RVF | Reverse vortex flow |
| FFT | Fast Fourier-transform | SEI | Specific energy input |
| FG | Forming gas | SEM | Scanning electron microscopy |
| FTIR | Fourier-transform infrared spectroscopy | SFE | Surface free energy |
| FVF | Forward vortex flow | SLM | Standard liter per minute |
| GAD | Gliding arc discharge | SOFC | Solid oxide fuel cell |
| HDPE | High density polyethylene | STEM | Scanning transmission electron microscopy |
| HMDSO | Hexamethyldisiloxane | TEOS | Tetraethyl orthosilicate |
| HV | High Voltage | TIG | Tungsten inert gas electric arc welding |
| IC | Integrated circuit | TTIP | Titanium isopropoxide |
| ICP | Inductively coupled plasma | VOC | volatile organic compounds |
| LCHV | Low-current high-voltage | XPS | X-ray photoelectron spectroscopy |
| LF | Low frequency | YSZ | Yttria-stabilized zirconia |
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| Abreviation | Plasma Generator/Nozzle | Power | Producer | Address | Reference |
|---|---|---|---|---|---|
| OpenAir | AS400/PFW 10 | 750 W | PlasmaTreat GmbH | Steinhagen, Germany | [151,152] |
| OpenAir-R | FG5001/RD1004 * | 2.3 kW | [151,153] | ||
| PB3 | PlasmBrush®PB3/A450 | 1.0 kW | relyon plasma GmbH | Regensburg, Germany | [154,155,156] |
| PB2 | PlasmBrush®PB2 | 500 W | Reinhausen Plasma GmbH | [157] | |
| P-Beam | PlasmaBeam | 500 W | Diener electronic GmbH | Ebhausen, Germany | [158,159,160] |
| P-BeamRT | PlasmaBeam RT * | 2 × 300 W | [158] | ||
| FaRi | GM-2000, GM-6000DV1 | 500 W | Shenzhen Fangrui | Guangming New District | [161] |
| FaRi-R | PM-G13A, GM-6000DVG3 * | 500 W | Technology Co., Ltd. | Shenzhen, China | [162,163,164] |
| P-Blaster | Plasma Blaster MEF | 200 W | Tigres GmbH | Marschacht, Germany | [165,166] |
| T-Jet | T-Jet | 600 W | [120] | ||
| P-Flux | PlasmaFlux | 2.5 kW | Atmospheric Plasma | Cary, NC, USA | [167] |
| P-Blast | PlasmaBlast Model 7000 | 2 kW | Solutions Inc. | Halifax, NS, Canada | [168,169] |
| AcXys-ULS | Ultra Light System (ULS) | 600 W | AcXys Technologies | Saint Martin le Vinoux, France | [170] |
| BlownIon | Blown-Ion 125 | 850 W | Enercon Industry | Germantown, WI, USA | [171] |
| P-Tec | PlasmaTec-X | 425 W | Tantec | Lunderskov, Denmark | [172,173,174,175] |
| Cirrus | Cirrus | 300 W | Henniker Plasma | Runcorn WA7 1TQ, UK | [174,176] |
| MPT | P-100A | 500 W | Shanghai Maohong Plasma Technology | Shanghai, China | [177] |
| P-Click | SSV1 | 500 W | Click Sun Shine Corp. | New Taipei City, Taiwan | [178] |
| Click-R | AC-PG-E-02 * | 1 kW | [179] | ||
| P-Jet | Plasma-Jet® | 160 W | Corotec Corporation | East Haven, CT, USA | [180] |
| P-Pen | Plasma Pen® PJ-2 | 150 W | PVA TePla America, Inc. | Corona, CA, USA | [181,182,183,184] |
| ToughP | ToughPlasma®FPE-20 | 1.8 kW | FUJI Corporation | Aichi, Japan | [185,186,187] |
| AETP | AP-5000 | 1.2 kW | AETP, Co., Ltd. | New Gueng-do, Republic of Korea | [188] |
| AETP-R | AP-5000R * | 1.0 kW | [188] | ||
| PlaJet | PlasmaJet® | 480 W | raantec GmbH | Borgholzhausen, Germany | [189] |
| PlaSphere | PlasmaSphere® * | 700 W | [189,190] |
| Device | Power | Gas | Flow Rate | NO | |||
|---|---|---|---|---|---|---|---|
| (SLM) | (%) | (ppm) | (ppm) | (ppm) | |||
| PB2 | 500 | 20 | 7.6 | — | 0 | 20 | |
| PB2 | 500 | CDA | 20 | 20.9 | 0.010 | 880 | 210 |
| PB3 | 1000 | 35 | 8.2 | 0.144 | 180 | 40 | |
| PB3 | 1000 | 43 | 7.8 | 0.089 | 140 | 60 | |
| PB3 | 1000 | 50 | 7.4 | 0.076 | 110 | 40 | |
| PB3 | 1000 | CDA | 35 | 20.7 | 0.619 | 2060 | 710 |
| PB3 | 1000 | CDA | 43 | 20.8 | 0.557 | 1810 | 590 |
| PB3 | 1000 | CDA | 50 | 20.7 | 0.292 | 1630 | 530 |
| Parameter | Air | Nitrogen |
|---|---|---|
| substrate material | COC | COC |
| substrate holder | PEEK board | PEEK board |
| applied nozzle | A250 | A250 |
| HV pulse frequency | 60 kHz | 60 kHz |
| power level | 100% | 100% |
| ionization gas | CDA | |
| gas flow | 42 SLM | 40 SLM |
| nozzle-substrate distance | 14–30 mm | 25–40 mm |
| space between tracks | 3 mm | 3 mm |
| movement speed of the PB3 | 250 mm/s | 250 mm/s |
| Parameter | Reduction | Oxidation |
|---|---|---|
| power level | 100% | 100% |
| nozzle-substrate distance | 12 mm | 10 mm |
| pulse frequency | 60 kHz | 60 kHz |
| speed | 100 mm/s | 100 mm/s |
| plasma gas | FG95/5 | CDA |
| plasma gas flow | 57 SLM | 57 SLM |
| plasma bridge gas | Ar | Ar |
| plasma bridge gas flow | 7 SLM | 7 SLM |
| length of treatment path | 180 mm | 180 mm |
| step between paths | 4 mm | 8 mm |
| number of paths | 24 | 12 |
| number of runs | 3 | 4 |
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© 2026 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license.
Share and Cite
Korzec, D.; Hoppenthaler, F.; Lerach, S. Low-Current High-Voltage Vortex-Stabilized Pulsed Arc Atmospheric-Pressure Plasma Jets: Processes and Processing. Plasma 2026, 9, 24. https://doi.org/10.3390/plasma9030024
Korzec D, Hoppenthaler F, Lerach S. Low-Current High-Voltage Vortex-Stabilized Pulsed Arc Atmospheric-Pressure Plasma Jets: Processes and Processing. Plasma. 2026; 9(3):24. https://doi.org/10.3390/plasma9030024
Chicago/Turabian StyleKorzec, Dariusz, Florian Hoppenthaler, and Simona Lerach. 2026. "Low-Current High-Voltage Vortex-Stabilized Pulsed Arc Atmospheric-Pressure Plasma Jets: Processes and Processing" Plasma 9, no. 3: 24. https://doi.org/10.3390/plasma9030024
APA StyleKorzec, D., Hoppenthaler, F., & Lerach, S. (2026). Low-Current High-Voltage Vortex-Stabilized Pulsed Arc Atmospheric-Pressure Plasma Jets: Processes and Processing. Plasma, 9(3), 24. https://doi.org/10.3390/plasma9030024

