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Journal: J. Compos. Sci., 2026
Volume: 10
Number: 351

Article: Vertically Aligned Boron Nitride Fiber Paper Thermal Interface Materials with High Electrical Insulation for Electronics Heat Dissipation
Authors: by Zexi Chen, Yixin Chen, Xu Huang and Sheng Chu
Link: https://www.mdpi.com/2504-477X/10/7/351

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