Choi, S.-G.; Kim, S.; Lee, J.; Kim, K.-S.; Hyun, S.
Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates. J. Manuf. Mater. Process. 2025, 9, 352.
https://doi.org/10.3390/jmmp9110352
AMA Style
Choi S-G, Kim S, Lee J, Kim K-S, Hyun S.
Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates. Journal of Manufacturing and Materials Processing. 2025; 9(11):352.
https://doi.org/10.3390/jmmp9110352
Chicago/Turabian Style
Choi, Sang-Gyu, Sangwook Kim, Jinkwan Lee, Keun-Soo Kim, and Soongkeun Hyun.
2025. "Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates" Journal of Manufacturing and Materials Processing 9, no. 11: 352.
https://doi.org/10.3390/jmmp9110352
APA Style
Choi, S.-G., Kim, S., Lee, J., Kim, K.-S., & Hyun, S.
(2025). Optimization of Direct Bonding Process for Lotus-Type Porous Copper to Alumina Substrates. Journal of Manufacturing and Materials Processing, 9(11), 352.
https://doi.org/10.3390/jmmp9110352