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Journal: J. Manuf. Mater. Process., 2022
Volume: 6
Number: 97
Article:
In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
Authors:
by
Heebum Chun, William Park, Jungsub Kim and ChaBum Lee
Link:
https://www.mdpi.com/2504-4494/6/5/97
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