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Journal: J. Manuf. Mater. Process., 2022
Volume: 6
Number: 97

Article: In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface
Authors: by Heebum Chun, William Park, Jungsub Kim and ChaBum Lee
Link: https://www.mdpi.com/2504-4494/6/5/97

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