Guenther, T.; Werum, K.; Müller, E.; Wolf, M.; Zimmermann, A.
Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications. J. Manuf. Mater. Process. 2022, 6, 9.
https://doi.org/10.3390/jmmp6010009
AMA Style
Guenther T, Werum K, Müller E, Wolf M, Zimmermann A.
Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications. Journal of Manufacturing and Materials Processing. 2022; 6(1):9.
https://doi.org/10.3390/jmmp6010009
Chicago/Turabian Style
Guenther, Thomas, Kai Werum, Ernst Müller, Marius Wolf, and André Zimmermann.
2022. "Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications" Journal of Manufacturing and Materials Processing 6, no. 1: 9.
https://doi.org/10.3390/jmmp6010009
APA Style
Guenther, T., Werum, K., Müller, E., Wolf, M., & Zimmermann, A.
(2022). Characterization of Wire-Bonding on LDS Materials and HF-PCBs for High-Frequency Applications. Journal of Manufacturing and Materials Processing, 6(1), 9.
https://doi.org/10.3390/jmmp6010009