Hai, V.N.; Lee, S.; Tsuchiya, T.; Katsumi, T.; Kita, K.; Matsuda, K.
DSC and TEM Investigation of Precipitation Behavior in a Cold-Rolled Pre-Aged Al-Mg-Si-Cu Alloy. J. Manuf. Mater. Process. 2026, 10, 167.
https://doi.org/10.3390/jmmp10050167
AMA Style
Hai VN, Lee S, Tsuchiya T, Katsumi T, Kita K, Matsuda K.
DSC and TEM Investigation of Precipitation Behavior in a Cold-Rolled Pre-Aged Al-Mg-Si-Cu Alloy. Journal of Manufacturing and Materials Processing. 2026; 10(5):167.
https://doi.org/10.3390/jmmp10050167
Chicago/Turabian Style
Hai, Vu Ngoc, Seungwon Lee, Taiki Tsuchiya, Tetsuya Katsumi, Kazuhiko Kita, and Kenji Matsuda.
2026. "DSC and TEM Investigation of Precipitation Behavior in a Cold-Rolled Pre-Aged Al-Mg-Si-Cu Alloy" Journal of Manufacturing and Materials Processing 10, no. 5: 167.
https://doi.org/10.3390/jmmp10050167
APA Style
Hai, V. N., Lee, S., Tsuchiya, T., Katsumi, T., Kita, K., & Matsuda, K.
(2026). DSC and TEM Investigation of Precipitation Behavior in a Cold-Rolled Pre-Aged Al-Mg-Si-Cu Alloy. Journal of Manufacturing and Materials Processing, 10(5), 167.
https://doi.org/10.3390/jmmp10050167