Tseng, S.H.; Yeh, C.Y.; Chang, A.Y.; Wang, Y.J.; Chen, P.C.; Tsai, H.H.; Juang, Y.Z.
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process. Proceedings 2017, 1, 337.
https://doi.org/10.3390/proceedings1040337
AMA Style
Tseng SH, Yeh CY, Chang AY, Wang YJ, Chen PC, Tsai HH, Juang YZ.
A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process. Proceedings. 2017; 1(4):337.
https://doi.org/10.3390/proceedings1040337
Chicago/Turabian Style
Tseng, S. H., C. Y. Yeh, A. Y. Chang, Y. J. Wang, P. C. Chen, H. H. Tsai, and Y. Z. Juang.
2017. "A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process" Proceedings 1, no. 4: 337.
https://doi.org/10.3390/proceedings1040337
APA Style
Tseng, S. H., Yeh, C. Y., Chang, A. Y., Wang, Y. J., Chen, P. C., Tsai, H. H., & Juang, Y. Z.
(2017). A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process. Proceedings, 1(4), 337.
https://doi.org/10.3390/proceedings1040337