Temperature-Dependent Residual Stresses and Thermal Expansion Coefficient of VO2 Thin Films
Abstract
1. Introduction
2. Materials and Methods
2.1. Thin Film Preparation
2.2. Residual Stress Measurement
3. Results
3.1. VO2 Coated on B270 Substrate
3.2. VO2 Coated on H-K9L Substrate
3.3. Evaluation of the CTE and Biaxial Modulus for VO2 Thin Films
4. Conclusions
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Glass Substrate | B270 | H-K9L |
---|---|---|
CTE (°C−1) | 8.2 × 10−6 | 7.6 × 10−6 |
Young’s modulus (GPa) | 71.5 | 79 |
Poisson ratio | 0.219 | 0.214 |
Thickness (mm) | 1.5 | 1.5 |
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Tien, C.-L.; Chiang, C.-Y.; Wang, C.-C.; Lin, S.-C. Temperature-Dependent Residual Stresses and Thermal Expansion Coefficient of VO2 Thin Films. Inventions 2024, 9, 61. https://doi.org/10.3390/inventions9030061
Tien C-L, Chiang C-Y, Wang C-C, Lin S-C. Temperature-Dependent Residual Stresses and Thermal Expansion Coefficient of VO2 Thin Films. Inventions. 2024; 9(3):61. https://doi.org/10.3390/inventions9030061
Chicago/Turabian StyleTien, Chuen-Lin, Chun-Yu Chiang, Ching-Chiun Wang, and Shih-Chin Lin. 2024. "Temperature-Dependent Residual Stresses and Thermal Expansion Coefficient of VO2 Thin Films" Inventions 9, no. 3: 61. https://doi.org/10.3390/inventions9030061
APA StyleTien, C.-L., Chiang, C.-Y., Wang, C.-C., & Lin, S.-C. (2024). Temperature-Dependent Residual Stresses and Thermal Expansion Coefficient of VO2 Thin Films. Inventions, 9(3), 61. https://doi.org/10.3390/inventions9030061