Next Article in Journal
Facile Synthesis and Characterization of a Bromine-Substituted (Chloromethyl)Pyridine Precursor towards the Immobilization of Biomimetic Metal Ion Chelates on Functionalized Carbons
Next Article in Special Issue
The Growth Behavior of Amorphous Hydrogenated Carbon a-C:H Layers on Industrial Polycarbonates—A Weak Interlayer and a Distinct Dehydrogenation Zone
Previous Article in Journal / Special Issue
Fused Filament Fabrication Three-Dimensional Printing Multi-Functional of Polylactic Acid/Carbon Black Nanocomposites
Article

Reduction of Device Operating Temperatures with Graphene-Filled Thermal Interface Materials

Phonon Optimized Engineered Materials (POEM) Center, Bourns College of Engineering, University of California-Riverside, Riverside, CA 92521, USA
Present address: Intel Corporation, Hillsboro, OR 97124, USA.
Academic Editor: Gil Goncalves
Received: 16 June 2021 / Revised: 15 July 2021 / Accepted: 15 July 2021 / Published: 21 July 2021
The majority of research into few layer graphene (FLG) thermal interface materials (TIM) concerns the direct quantification of innate composite properties with much less direct analysis of these materials in realistic applications. In this study, equilibrium temperatures of engineered device substitutes fixed to passive heat sink solutions with varying FLG concentration TIMs are experimentally measured at varying heat dissipation rates. A custom, precisely-controlled heat source’s temperature is continually measured to determine equilibrium temperature at a particular heat dissipation. It is found that altering the used FLG TIM concentrations from 0 vol.% to as little as 7.3 vol.% resulted in a decrease of combined TIM and passively-cooled heat sink thermal resistance from 4.23C/W to 2.93C/W, amounting to a reduction in operating temperature of ≈108C down to ≈85C at a heat dissipation rate of 20 W. The results confirm FLG TIMs’ promising use in the application of device heat dissipation in a novel, controllable experimental technique. View Full-Text
Keywords: graphene; thermal interface materials; temperature; passive cooling; power density; heat sink; VLSI cooling; thermal resistance graphene; thermal interface materials; temperature; passive cooling; power density; heat sink; VLSI cooling; thermal resistance
Show Figures

Graphical abstract

  • Supplementary File 1:

    ZIP-Document (ZIP, 864 KiB)

  • Externally hosted supplementary file 1
    Link: https://doi.org/10.3390/c6020026
    Description: NOTE: The version had to be reverted for introduced English errors. I am sorry for the inconvenience. As per Doris Yang's approval, this version's text is not to be edited beyond formatting. Thanks! In the Non-published material is the response to the line-by-line requests for edits. I just use it as a checklist.
MDPI and ACS Style

Lewis, J.S. Reduction of Device Operating Temperatures with Graphene-Filled Thermal Interface Materials. C 2021, 7, 53. https://doi.org/10.3390/c7030053

AMA Style

Lewis JS. Reduction of Device Operating Temperatures with Graphene-Filled Thermal Interface Materials. C. 2021; 7(3):53. https://doi.org/10.3390/c7030053

Chicago/Turabian Style

Lewis, Jacob S. 2021. "Reduction of Device Operating Temperatures with Graphene-Filled Thermal Interface Materials" C 7, no. 3: 53. https://doi.org/10.3390/c7030053

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop