Single- and Multilayer Build-Up of an Antibacterial Temperature- and UV-Curing Sol–Gel System with Atmospheric Pressure Plasma
Abstract
:1. Introduction
2. Results and Discussion
2.1. Chemical Composition
FTIR Studies
2.2. Film Structure and Surface Properties
2.2.1. Morphology Studies
2.2.2. Critical Loads and Tribology
2.2.3. Wettability
2.3. Antibacterial Tests
3. Conclusions
4. Experimental Setup and Characterization
4.1. Sol–Gel Preparation
4.2. Sample Preparation
4.3. Curing Process with Atmospheric Pressure Plasma
4.4. Post-Growth Characterization
4.4.1. Optical Characterization
4.4.2. Structural Characterization
4.4.3. Tribological Characterization
4.4.4. Biological Characterization
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Assignments | Peak (cm−1) | Relative Intensity * Slightly Acidic|Alkaline 0 h, 24 h|0 h, 24 h | References |
---|---|---|---|
Si-OH | 950 | 0.35, 0.29|0.34, 0.24 | [3,4,13,14,15,16] |
Si-OCH2CH3 | 1163 | 0.33, 0.26|0.34, 0.22 | [3,4,17,18] |
1100 | 0.68, 0.62|0.74, 0.65 | ||
1067 | 0.94, 0.63|0.97, 0.60 | ||
950 | 0.35, 0.29|0.34, 0.24 | ||
Si-O-Si | 1039 | 1.00, 0.83|1.00, 0.80 | [3,4,13,14,15,16,17,18] |
1013 | 0.85, 1.00|0.84, 1.00 | ||
700 | 0.23, 0.25|0.21, 0.25 | ||
Si-CH3 | 1260 | 0.14, 0.10|0.39, 0.10 | [3,4] |
800–760 | 0.48, 0.31|0.48, 0.30 | ||
C=C | 1640 | 0.11, 0.14|0.11, 0.16 | |
C=O | 1716 | 0.29, 0.30|0.29, 0.29 | [3,4,5] |
Plasma Powder Treatment | ||||||||
---|---|---|---|---|---|---|---|---|
Parameter | Powder | C [A] | MS [mm/s] | TT [s] | PG | GF [L/min] | S-P D [mm] | PF [g/min] |
Powder 1 | Copper | 180 | 500 | 10 | Argon | 10 | 150 | 2 |
Powder 2 | Copper | 120 | 500 | 10 | Argon | 10 | 150 | 2 |
Powder 3 | Zinc | 180 | 500 | 10 | Argon | 10 | 150 | 2 |
Powder 4 | Zinc | 120 | 500 | 10 | Argon | 10 | 150 | 2 |
Powder 5 | Copper Flakes | - | 50 | 100 | - | - | 250 | 2 |
Powder 6 | Copper Flakes | - | 75 | 75 | - | - | 250 | 2 |
Powder 7 | Copper Flakes | - | 100 | 50 | - | - | 250 | 2 |
Plasma Treatment | ||||||
---|---|---|---|---|---|---|
Parameter | C [A] | MS [mm/s] | TT [s] | PG | GF [L/min] | S-P D [mm] |
Plasma 1 | 250 | 100 | 160 | Argon | 10 | 250 |
Plasma 2 | 180 250 | 100 | 40 120 | Argon | 10 | 250 |
Plasma 3 | 180 250 | 100 | 80 80 | Argon | 10 | 250 |
Plasma 4 | 180 250 | 100 | 40 80 | Argon | 10 | 250 |
Without TiO2 − Top Layer | With TiO2 − Top Layer | |||
---|---|---|---|---|
Element | In Layer | Top Layer | In Layer | Top Layer |
O | 65.1 | 65.8 | 62.7 | 75.1 |
Si | 32.7 | 32.0 | 34.7 | 5.9 |
Ti | 2.2 | 2.3 | 2.6 | 19.0 |
Coating | Layer Thickness [µm] |
---|---|
Sol–Gel with TTIP | 145.8 ± 9.7 |
Sol–Gel with TTIP + TiO2 | 232.5 ± 25.3 |
Plasma Adhesion Layer Treatment | ||||||||
---|---|---|---|---|---|---|---|---|
Parameter | Precursor | C [A] | MS [mm/s] | TT [s] | PG | GF [L/min] | S-P D [mm] | PrF [mL/min] |
Adhesion 1 | HMDSO | 180 | 100 | 40 | Argon | 10 | 250 | 80 |
Coating | Parameters | Scratch Hardness [N] |
---|---|---|
Alkaline One Layer | Plasma 1 | 12.7 ± 0.5 |
Slightly acidic One Layer | Plasma 1 | 14.3 ± 0.5 |
Acidic One Layer | Plasma 1 | 14.7 ± 0.5 |
Alkaline Three Layers | Plasma 1 | 8.3 ± 0.5 |
Slightly acidic Three Layers | Plasma 1 | 8.7 ± 0.5 |
Acidic Three Layers | Plasma 1 | 6.0 ± 0.8 |
Copper Sol–Gel One Layer | Plasma 1 | 12.7 ± 0.5 |
Zinc Sol–Gel One Layer | Plasma 1 | 14.7 ± 0.5 |
Sol–Gel with TTIP Five Layers | Plasma 2 | 18.0 ± 0.8 |
Sol–Gel with TTIP + TiO2 Five Layers | Plasma 2 | 17.7 ± 0.5 |
Sample | Parameter | Reduction in CFU after 0.5 h | Reduction in CFU after 3 h |
---|---|---|---|
Cu1 | Powder 1 Plasma 1 | 63.53% | 99.98% |
Cu2 | Powder 2 Plasma 1 | 54.30% | 99.39% |
Cu3 | Powder 1 Plasma 2 | 26.72% | 99.50% |
Zn1 | Powder 3 Plasma 1 | 80.26% | 99.96% |
Zn2 | Powder 4 Plasma 1 | 90.87% | 99.99% |
Zn3 | Powder 3 Plasma 2 | 71.20% | 99.98% |
Cu4 | Powder 1 Plasma 4 | 34.82% | 93.89% |
Cu4 polished | Powder 1 Plasma 4 | 81.70% | 99.99% |
Cu5 | Powder 2 Plasma 4 | 29.22% | 92.49% |
Cu5 polished | Powder 2 Plasma 4 | 89.70% | 99.99% |
Cu-Flakes 1 | Powder 5 Plasma 2 | 98.23% | 99.99% |
Cu-Flakes 2 | Powder 6 Plasma 2 | 99.68% | 99.99% |
Cu-Flakes 3 | Powder 7 Plasma 2 | 97.60% | 99.99% |
Sol–Gel with TTIP | Plasma 2 | 11.86% | 62.06% |
Reference | Plasma 2 | 9.94% | 62.42% |
Sol–Gel Coating | ||||
---|---|---|---|---|
Sample | Layer Thickness Applied [µm] | Layer Thickness after Treatment [µm] | Room Temperature [°C] | Humidity % |
Sol–Gel Coating (any pH value) | 20 | 5 | 25 | 60 |
TTIP Sol–Gel Coating | 20 | 5 | 25 | 60 |
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Chwatal, S.; Pölzl, S.; Kittinger, C.; Lackner, J.M.; Coclite, A.M.; Waldhauser, W. Single- and Multilayer Build-Up of an Antibacterial Temperature- and UV-Curing Sol–Gel System with Atmospheric Pressure Plasma. Gels 2023, 9, 675. https://doi.org/10.3390/gels9090675
Chwatal S, Pölzl S, Kittinger C, Lackner JM, Coclite AM, Waldhauser W. Single- and Multilayer Build-Up of an Antibacterial Temperature- and UV-Curing Sol–Gel System with Atmospheric Pressure Plasma. Gels. 2023; 9(9):675. https://doi.org/10.3390/gels9090675
Chicago/Turabian StyleChwatal, Simon, Sabine Pölzl, Clemens Kittinger, Jürgen Markus Lackner, Anna Maria Coclite, and Wolfgang Waldhauser. 2023. "Single- and Multilayer Build-Up of an Antibacterial Temperature- and UV-Curing Sol–Gel System with Atmospheric Pressure Plasma" Gels 9, no. 9: 675. https://doi.org/10.3390/gels9090675