Wang, Y.; Zhang, F.; Dou, L.; Li, Y.; Wang, K.; Shi, Z.; Du, L.; Zhang, W.; Wang, Z.
Mechanisms of Covalent Bonds in Enhancing the Adsorption Stability of Clay–Polymer Gels in High-Temperature Environments. Gels 2025, 11, 623.
https://doi.org/10.3390/gels11080623
AMA Style
Wang Y, Zhang F, Dou L, Li Y, Wang K, Shi Z, Du L, Zhang W, Wang Z.
Mechanisms of Covalent Bonds in Enhancing the Adsorption Stability of Clay–Polymer Gels in High-Temperature Environments. Gels. 2025; 11(8):623.
https://doi.org/10.3390/gels11080623
Chicago/Turabian Style
Wang, Yu, Fan Zhang, Liangbin Dou, Yutong Li, Kaiwen Wang, Zhengli Shi, Leyao Du, Wangyuan Zhang, and Zonglun Wang.
2025. "Mechanisms of Covalent Bonds in Enhancing the Adsorption Stability of Clay–Polymer Gels in High-Temperature Environments" Gels 11, no. 8: 623.
https://doi.org/10.3390/gels11080623
APA Style
Wang, Y., Zhang, F., Dou, L., Li, Y., Wang, K., Shi, Z., Du, L., Zhang, W., & Wang, Z.
(2025). Mechanisms of Covalent Bonds in Enhancing the Adsorption Stability of Clay–Polymer Gels in High-Temperature Environments. Gels, 11(8), 623.
https://doi.org/10.3390/gels11080623