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        Journal: Processes, 2023
        Volume: 11 
                	Number: 1649 
                
        
        Article:
        Influence of Sputtering Pressure on the Micro-Topography of Sputtered Cu/Si Films: Integrated Multiscale Simulation 
        Authors: 
       	by
                    Guo Zhu, Mengxin Han, Baijun Xiao and Zhiyin Gan        
        Link:
        https://www.mdpi.com/2227-9717/11/6/1649
        
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