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Journal: Processes, 2023
Volume: 11
Number: 1649
Article:
Influence of Sputtering Pressure on the Micro-Topography of Sputtered Cu/Si Films: Integrated Multiscale Simulation
Authors:
by
Guo Zhu, Mengxin Han, Baijun Xiao and Zhiyin Gan
Link:
https://www.mdpi.com/2227-9717/11/6/1649
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