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Open AccessArticle

A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding

1
Instrument Center, National Cheng Kung University, Tainan 701, Taiwan
2
Department of Materials Science and Engineering, National Cheng Kung University, Tainan 701, Taiwan
*
Author to whom correspondence should be addressed.
Electronics 2019, 8(7), 792; https://doi.org/10.3390/electronics8070792
Received: 9 May 2019 / Revised: 4 July 2019 / Accepted: 15 July 2019 / Published: 15 July 2019
(This article belongs to the Section Microelectronics and Optoelectronics)
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Abstract

Palladium-coated copper wire with a flash-gold layer (PCA) is an oxidation-resistant fine wire that simultaneously has the properties of palladium-coated copper wire (PCC) and gold-coated copper wire. This research used an extreme sulfidation test to compare corrosion resistance between the PCC and PCA wires. In addition to closely examining the morphology of the wires, the internal matrix after the sulfidation test is also discussed. In doing so, the PCA wire was bonded onto the aluminum pads and the sulfidation test was conducted. Then, we observed its morphology and elemental distribution and found that the flash-gold layer of the PCA wire effectively enhanced resistance to sulfidation corrosion. Because the copper ball had an alloying effect on the ball bonding, it produced different shapes of sulfide after the sulfidation test. The degree of corrosion on the wedge bond was different because of the presence or absence of the coated layer. In contrast, the flash-gold layer of the PCA wire enhanced the bonding force and retained low resistance characteristics after the sulfidation test. View Full-Text
Keywords: copper wire; flash-gold layer; wire bonding; sulfidation copper wire; flash-gold layer; wire bonding; sulfidation
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Chen, K.-J.; Hung, F.-Y.; Chang, C.-Y. A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding. Electronics 2019, 8, 792.

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