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Journal: Electronics, 2019
Volume: 8
Number: 792
Article:
A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding
Authors:
by
Kuan-Jen Chen, Fei-Yi Hung and Chia-Yun Chang
Link:
https://www.mdpi.com/2079-9292/8/7/792
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