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Journal: Electronics, 2019
Volume: 8
Number: 792

Article: A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding
Authors: by Kuan-Jen Chen, Fei-Yi Hung and Chia-Yun Chang
Link: https://www.mdpi.com/2079-9292/8/7/792

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