Ali, M.; Watanabe, A.; Kakutani, T.; Raj, P.M.; Tummala, R.R.; Swaminathan, M.
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules. Electronics 2025, 14, 1670.
https://doi.org/10.3390/electronics14081670
AMA Style
Ali M, Watanabe A, Kakutani T, Raj PM, Tummala RR, Swaminathan M.
Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules. Electronics. 2025; 14(8):1670.
https://doi.org/10.3390/electronics14081670
Chicago/Turabian Style
Ali, Muhammad, Atom Watanabe, Takenori Kakutani, Pulugurtha M. Raj, Rao. R. Tummala, and Madhavan Swaminathan.
2025. "Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules" Electronics 14, no. 8: 1670.
https://doi.org/10.3390/electronics14081670
APA Style
Ali, M., Watanabe, A., Kakutani, T., Raj, P. M., Tummala, R. R., & Swaminathan, M.
(2025). Package Integration and System Performance Analysis of Glass-Based Passive Components for 5G New Radio Millimeter-Wave Modules. Electronics, 14(8), 1670.
https://doi.org/10.3390/electronics14081670