Wang, G.; Li, Z.; Li, Z.; Liang, H.; Qin, L.; Liu, Y.; Zhang, W.; Huang, X.
Investigation of Dynamic Testing Methods for Composite Thermoelectric Devices Under Multi-Condition Loading. Electronics 2025, 14, 4938.
https://doi.org/10.3390/electronics14244938
AMA Style
Wang G, Li Z, Li Z, Liang H, Qin L, Liu Y, Zhang W, Huang X.
Investigation of Dynamic Testing Methods for Composite Thermoelectric Devices Under Multi-Condition Loading. Electronics. 2025; 14(24):4938.
https://doi.org/10.3390/electronics14244938
Chicago/Turabian Style
Wang, Gao, Zhiling Li, Zhixian Li, Haijian Liang, Liming Qin, Yang Liu, Wei Zhang, and Xiaodong Huang.
2025. "Investigation of Dynamic Testing Methods for Composite Thermoelectric Devices Under Multi-Condition Loading" Electronics 14, no. 24: 4938.
https://doi.org/10.3390/electronics14244938
APA Style
Wang, G., Li, Z., Li, Z., Liang, H., Qin, L., Liu, Y., Zhang, W., & Huang, X.
(2025). Investigation of Dynamic Testing Methods for Composite Thermoelectric Devices Under Multi-Condition Loading. Electronics, 14(24), 4938.
https://doi.org/10.3390/electronics14244938