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Journal: Electronics, 2025
Volume: 14
Number: 2682
Article:
Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review
Authors:
by
Seung-Hoon Lee, Su-Jong Kim, Ji-Su Lee and Seok-Ho Rhi
Link:
https://www.mdpi.com/2079-9292/14/13/2682
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