Hu, L.; Qin, Y.; Wan, Y.; Yu, C.; Ruan, B.; Tian, R.; Wang, B.; Wang, H.
Predicting Occupant Annoyance in Acoustic-Thermal Compound Environments. Electronics 2025, 14, 1932.
https://doi.org/10.3390/electronics14101932
AMA Style
Hu L, Qin Y, Wan Y, Yu C, Ruan B, Tian R, Wang B, Wang H.
Predicting Occupant Annoyance in Acoustic-Thermal Compound Environments. Electronics. 2025; 14(10):1932.
https://doi.org/10.3390/electronics14101932
Chicago/Turabian Style
Hu, Li, Yachao Qin, Yeqing Wan, Chenglin Yu, Bing Ruan, Ruili Tian, Bo Wang, and Huawei Wang.
2025. "Predicting Occupant Annoyance in Acoustic-Thermal Compound Environments" Electronics 14, no. 10: 1932.
https://doi.org/10.3390/electronics14101932
APA Style
Hu, L., Qin, Y., Wan, Y., Yu, C., Ruan, B., Tian, R., Wang, B., & Wang, H.
(2025). Predicting Occupant Annoyance in Acoustic-Thermal Compound Environments. Electronics, 14(10), 1932.
https://doi.org/10.3390/electronics14101932