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Journal: Electronics, 2024
Volume: 13
Number: 839

Article: Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
Authors: by Yuhang Yin, Chenhui Xia, Shuli Liu, Zhimo Zhang, Chen Chen, Gang Wang, Chenqian Wang and Yafei Wu
Link: https://www.mdpi.com/2079-9292/13/5/839

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