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Journal: ElectronicsVolume: 13Number: 839
Article: Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
  • Authors:
  • Yuhang Yin1,*,
  • Chenhui Xia1 and
  • Shuli Liu1
  • et al.
Link: https://www.mdpi.com/2079-9292/13/5/839

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