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Journal: Electronics, 2024
Volume: 13
Number: 839
Article:
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
Authors:
by
Yuhang Yin, Chenhui Xia, Shuli Liu, Zhimo Zhang, Chen Chen, Gang Wang, Chenqian Wang and Yafei Wu
Link:
https://www.mdpi.com/2079-9292/13/5/839
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