Bae, B.; Yang, K.; Kim, Y.; Kim, M.; Seong, Y.; Lee, J.; Cheon, J.
Novel Highly Flexible PCB Design Based on a Via-Less Meander Ground Structure to Transmit mm-Wave RF Signals in 5G Foldable Mobile Products. Electronics 2022, 11, 3209.
https://doi.org/10.3390/electronics11193209
AMA Style
Bae B, Yang K, Kim Y, Kim M, Seong Y, Lee J, Cheon J.
Novel Highly Flexible PCB Design Based on a Via-Less Meander Ground Structure to Transmit mm-Wave RF Signals in 5G Foldable Mobile Products. Electronics. 2022; 11(19):3209.
https://doi.org/10.3390/electronics11193209
Chicago/Turabian Style
Bae, Bumhee, Kwangmo Yang, Younho Kim, Minseok Kim, Younghun Seong, Jaehoon Lee, and Jeongnam Cheon.
2022. "Novel Highly Flexible PCB Design Based on a Via-Less Meander Ground Structure to Transmit mm-Wave RF Signals in 5G Foldable Mobile Products" Electronics 11, no. 19: 3209.
https://doi.org/10.3390/electronics11193209
APA Style
Bae, B., Yang, K., Kim, Y., Kim, M., Seong, Y., Lee, J., & Cheon, J.
(2022). Novel Highly Flexible PCB Design Based on a Via-Less Meander Ground Structure to Transmit mm-Wave RF Signals in 5G Foldable Mobile Products. Electronics, 11(19), 3209.
https://doi.org/10.3390/electronics11193209
